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US 2025/0079193 A1Published application
Substrate processing apparatus
AssigneeTes Co., Ltd
InventorsIn-Il JUNG, Hyeong-Wook Moon, Seung-Min OH, Jong-Seok LEE
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Abstract
Provided are a substrate processing apparatus and a substrate processing method, and more specifically, a substrate processing apparatus and a substrate processing method for easily cleaning an unnecessary thin film deposited on a lower surface and edge area of a substrate without inverting the substrate.
Claims13
A substrate processing apparatus comprising:
- a chamber providing a processing space for a substrate;
- an upper showerhead provided in the chamber configured to supply an inert gas toward an upper surface of the substrate and to which radio frequency (RF) power is applied;
- and
- a substrate supporting member that supports a lower surface of an edge of the substrate to supply a process gas toward a lower surface of the substrate and cleans the lower surface and bevel of the substrate by using plasma,
- wherein the substrate supporting member includes a substrate holder configured to support the lower surface of the edge of the substrate and a lower showerhead configured to supply the process gas toward the lower surface of the substrate, and
- the substrate holder includes a floating unit configured to float the substrate.
3 more elements
A substrate processing method of cleaning a lower surface and bevel of a substrate, the method comprising:
- loading the substrate on a substrate holder;
- lifting the substrate to a process height;
- supplying an inert gas toward an upper surface of the substrate;
- floating the substrate by supplying a floating gas toward the lower surface of the substrate;
- and
- cleaning the lower surface and bevel of the substrate by supplying a process gas toward the lower surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.