Plasma treatment apparatus and method
AssigneeJcu Corporation
InventorsKeisuke Asano, Kenichi Yamada, Tomohiro Kawasaki, Nobutaka Numagawa
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AssigneeJcu Corporation
InventorsKeisuke Asano, Kenichi Yamada, Tomohiro Kawasaki, Nobutaka Numagawa
Estimating the term…
A substrate is held in a substrate holder and accommodated in a treatment chamber. A positive electrode panel is arranged opposite to a surface of the substrate. Process gas is sent from a blower panel, toward the positive electrode panel and the substrate. A positive electrode of a high-frequency power source is connected to the positive electrode panel, and a negative electrode of the high-frequency power source is connected to the blower panel, to apply a high-frequency voltage. The process gas passes between the positive electrode panel and the blower panel which is the negative electrode, so that plasma is generated. The generated plasma removes contaminants on the surface of the substrate.
A plasma treatment apparatus, comprising:
Dependencies are inferred from the claim text.