G11C 5/02
Disposition of storage elements
Official title: Disposition of storage elements, e.g. in the form of a matrix array
G11C5/02 (Disposition of storage elements) appears on 7,200 US grants and 7,737 published applications in this corpus.
Search patents in G11C- Granted patents
- 7,200
- Published applications
- 7,737
- Assignees
- 738
- Inventors
- 8,428
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 9 | 0 |
| 1984 | 7 | 0 |
| 1985 | 6 | 0 |
| 1986 | 7 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 4 | 0 |
| 1990 | 3 | 0 |
| 1991 | 11 | 0 |
| 1992 | 13 | 0 |
| 1993 | 7 | 0 |
| 1994 | 25 | 0 |
| 1995 | 20 | 0 |
| 1996 | 23 | 0 |
| 1997 | 33 | 0 |
| 1998 | 55 | 0 |
| 1999 | 62 | 0 |
| 2000 | 76 | 0 |
| 2001 | 92 | 40 |
| 2002 | 116 | 126 |
| 2003 | 117 | 117 |
| 2004 | 106 | 123 |
| 2005 | 82 | 142 |
| 2006 | 102 | 211 |
| 2007 | 142 | 223 |
| 2008 | 156 | 263 |
| 2009 | 173 | 277 |
| 2010 | 209 | 236 |
| 2011 | 265 | 260 |
| 2012 | 233 | 225 |
| 2013 | 254 | 281 |
| 2014 | 288 | 285 |
| 2015 | 312 | 325 |
| 2016 | 323 | 276 |
| 2017 | 339 | 293 |
| 2018 | 278 | 395 |
| 2019 | 403 | 425 |
| 2020 | 413 | 454 |
| 2021 | 470 | 574 |
| 2022 | 439 | 507 |
| 2023 | 433 | 549 |
| 2024 | 475 | 425 |
| 2025 | 401 | 355 |
| 2026 | 190 | 350 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Power supply circuit, semiconductor device and electronic device6 Oct 2026US 12,755,762 B2SK hynix Inc.
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Semiconductor devices with wrap-around arrays29 Sep 2026US 12,749,518 B2Micron Technology, Inc.
- Semiconductor memory devices and methods of manufacturing thereof22 Sep 2026US 12,745,388 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional dynamic random access memory1 Sep 2026US 12,727,143 B2Winbond Electronics Corp.
- Reducing capacitive loading of memory system based on switches8 Oct 2026US 2026/0311734 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Systems including two-die integrated circuit (ic) packages and homogeneously-oriented memory connectors and related methods1 Oct 2026US 2026/0304961 A1Microsoft Technology Licensing, LLC
- Sense amplifier driver layout in 3d-dram24 Sep 2026US 2026/0290432 A1Micron Technology, Inc.
- Multiplexer layout and control in 3d-dram24 Sep 2026US 2026/0290435 A1Micron Technology, Inc.
- Memory cell capacitor structures for three-dimensional memory arrays24 Sep 2026US 2026/0293089 A1Micron Technology, Inc.
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Method and apparatus for generating a device ID for stacked devices631US 7,111,149 B2Intel Corporation · 2006
- Solid state memory system including plural memory chips and a serialized bus546US 5,430,859 ASunDisk Corporation · 1995
- Three-dimensional multichip package444US 5,481,133 AUnited Microelectronics Corp. · 1996
- Memory system including a point-to-point linked memory subsystem431US 6,502,161 B1Rambus Inc. · 2002