G11C 5/04
Supports for storage elements
Official title: Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports
G11C5/04 (Supports for storage elements) appears on 3,105 US grants and 3,471 published applications in this corpus.
Search patents in G11C- Granted patents
- 3,105
- Published applications
- 3,471
- Assignees
- 449
- Inventors
- 4,115
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 7 | 0 |
| 1996 | 8 | 0 |
| 1997 | 13 | 0 |
| 1998 | 21 | 0 |
| 1999 | 32 | 0 |
| 2000 | 36 | 0 |
| 2001 | 41 | 22 |
| 2002 | 56 | 60 |
| 2003 | 55 | 49 |
| 2004 | 47 | 56 |
| 2005 | 27 | 83 |
| 2006 | 63 | 159 |
| 2007 | 94 | 151 |
| 2008 | 96 | 143 |
| 2009 | 114 | 139 |
| 2010 | 114 | 115 |
| 2011 | 127 | 94 |
| 2012 | 92 | 82 |
| 2013 | 105 | 118 |
| 2014 | 118 | 111 |
| 2015 | 118 | 125 |
| 2016 | 133 | 131 |
| 2017 | 143 | 141 |
| 2018 | 127 | 152 |
| 2019 | 184 | 194 |
| 2020 | 180 | 206 |
| 2021 | 181 | 234 |
| 2022 | 182 | 185 |
| 2023 | 172 | 200 |
| 2024 | 168 | 174 |
| 2025 | 167 | 145 |
| 2026 | 77 | 202 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Method of forming ferroelectric chiplet in a multi-dimensional packaging with I/O switch embedded in a substrate or interposer25 Aug 2026US 12,717,479 B2Kepler Computing Inc.
- Smart dimm multiport memory system25 Aug 2026US 12,717,511 B2Sunrise Memory Corporation
- Intra-package memory die communication structures25 Aug 2026US 12,718,865 B2Micron Technology, Inc.
- NAND die with wire-bond inductive compensation for altered bond wire bandwidth in memory devices25 Aug 2026US 12,718,878 B2SanDisk Technologies LLC
- Systems including two-die integrated circuit (ic) packages and homogeneously-oriented memory connectors and related methods1 Oct 2026US 2026/0304961 A1Microsoft Technology Licensing, LLC
- Module mounting structure and electronic apparatus17 Sep 2026US 2026/0277275 A1Lenovo (Singapore) Pte. Ltd.
- Memory module insertion structures and methods3 Sep 2026US 2026/0261080 A1Micron Technology, Inc.
- Semiconductor device and electronic device27 Aug 2026US 2026/0252872 A1Semiconductor Energy Laboratory Co.Ltd.
- Method to implement half width modes in dram and doubling of bank resources27 Aug 2026US 2026/0253634 A1Intel Products IP LLC
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Solid state memory system including plural memory chips and a serialized bus546US 5,430,859 ASunDisk Corporation · 1995
- Memory system including a point-to-point linked memory subsystem431US 6,502,161 B1Rambus Inc. · 2002
- Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems424US 5,663,901 ASanDisk Corporation · 1997
- Synchronous memory packaged in single/dual in-line memory module and method of fabrication405US 5,513,135 AInternational Business Machines Corporation · 1996