G11C 5/05
Supporting of cores in matrix
G11C5/05 (Supporting of cores in matrix) appears on 21 US grants and 19 published applications in this corpus.
Search patents in G11C- Granted patents
- 21
- Published applications
- 19
- Assignees
- 14
- Inventors
- 35
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 1 |
| 2009 | 1 | 1 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 1 | 1 |
| 2014 | 1 | 3 |
| 2015 | 2 | 1 |
| 2016 | 1 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 0 |
| 2020 | 0 | 1 |
| 2021 | 2 | 3 |
| 2022 | 2 | 2 |
| 2023 | 2 | 1 |
| 2024 | 2 | 1 |
| 2025 | 0 | 0 |
| 2026 | 1 | 0 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Powergate biasing techniques for memory applications9 Jan 2024US 11,869,572 B2Arm Limited
- Integrated counter in memory device2 Jan 2024US 11,862,291 B2
- DRAM with inter-section, page-data-copy scheme for low power and wide data access8 Aug 2023US 11,721,390 B2Piecemakers Technology, Inc.
- Mixed digital-analog memory devices and circuits for secure storage and computing4 Jul 2023US 11,694,744 B2Hefei Reliance Memory Limited
- Method of manufacturing memory device21 Nov 2024US 2024/0389321 A1Winbond Electronics Corp.
- Integrated counter in memory device19 Jan 2023US 2023/0015255 A1Metacni Co.,Ltd.
- DRAM with inter-section, page-data-copy scheme for low power and wide data access28 Apr 2022US 2022/0130450 A1Piecemakers Technology, Inc.
- Read only memory architecture for analog matrix operations27 Jan 2022US 2022/0028444 A1Robert Bosch GmbH
- Mixed digital-analog memory devices and circuits for secure storage and computing28 Oct 2021US 2021/0335415 A1Hefei Reliance Memory Limited
Most cited
By later US patents
- Memory cards and electronic machines20US 8,456,850 B2Samsung Electronics Co., Ltd. · 2013
- Memory architecture and addressing for optimized density in integrated circuit package or on circuit board14US 6,188,595 B1Micron Technology, Inc. · 2001
- Memory architecture and addressing for optimized density in integrated circuit package or on circuit board14US 6,496,400 B2Micron Technology, Inc. · 2002
- Interconnections for crosswire arrays5US 7,629,694 B22009
- Memory cards and electronic machines5US 9,048,557 B2Samsung Electronics Co., Ltd. · 2015