US 2026/0304961 A1 · SYSTEMS INCLUDING TWO-DIE INTEGRATED CIRCUIT (IC) PACKAGES AND HOMOGENEOUSLY-ORIENTED MEMORY CONNECTORS AND RELATED METHODS

Abstract

A two-die integrated circuit (IC) package is coupled to dual in-line memory module (DIMM) connectors. The DIMM connectors are homogeneously-oriented (e.g., in a same direction) but the dies on the IC package are oriented opposite to each other. The DIMM connectors are homogeneously oriented to avoid issues with memory card insertion and to minimize DIMM connector density. Because the DIMM connectors are coupled to both of the dies on the IC package, and the dies are oriented opposite to each other, the sub-channels of the physical interfaces (PHYs) on a second die of the two dies is oriented opposite to the sub-channel interfaces in the DIMM connectors. The second die directs memory transactions of a first sub-channel through a second sub-channel interface driver in the PHY and the other die directs memory transactions of a first sub-channel of the memory through a first sub-channel interface driver in the PHY.

Claims20

Dependent claims

A system comprising:

a system substrate;
an integrated circuit (IC) package on the system substrate;
and
a plurality of dual in-line memory module (DIMM) connectors each having a same longitudinal orientation in a first direction on the system substrate,
wherein:
the plurality of DIMM connectors comprises:
a plurality of first-side DIMM connectors on a first side of the IC package;
and
a plurality of second-side DIMM connectors on a second side of the IC package;
and
the IC package comprises:
a first die oriented along a die axis extending in the first direction;
and
a second die oriented opposite to the first die along the die axis.

11 more elements

An integrated circuit (IC) package, comprising:

a package substrate;
a first die having a first orientation on the package substrate along a die axis extending in a first direction;
a second die identical to the first die and having a second orientation on the IC package, opposite to the first orientation along the die axis,
wherein:
each of the first die and the second die comprises a first physical interface (PHY) comprising:
a first sub-channel interface driver configured to access a first sub-channel interface of a first dual in-line memory module (DIMM) connector;
and
a second sub-channel interface driver configured to access a second sub-channel interface of the first DIMM connector;
the first sub-channel interface driver of the first PHY in the first die is configured to couple to a first sub-channel interface of a first DIMM connector on a first side of the IC package substrate;
and
the second sub-channel interface driver of the first PHY on the second die is configured to couple to a first sub-channel interface of a second DIMM connector on a second side of the package substrate.

8 more elements

Dependencies are inferred from the claim text.

Facts

Application

19/096,355Filed 31 Mar 2025

Published

1 Oct 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10D 89/10
Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00: integrated device layouts
G11C 5/04
Disposition of storage elements, e.g. in the form of a matrix array: supports for storage elements , e.g. memory modules; Mounting or fixing of…
H01R 12/721
Coupling with the edge of the rigid printed circuits or like structures: cooperating directly with the edge of the rigid printed circuits
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections

Systems including two-die integrated circuit (ic) packages and homogeneously-oriented memory connectors and related methods

Life of this patent

Systems including two-die integrated circuit (ic) packages and homogeneously-oriented memory connectors and related methods

Life of this patent

Abstract

Claims20