Module mounting structure and electronic apparatus
AssigneeLenovo (Singapore) Pte. Ltd.
InventorsTadashi Kosuga, Makoto Hashikura
Life of this patent
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AssigneeLenovo (Singapore) Pte. Ltd.
InventorsTadashi Kosuga, Makoto Hashikura
Estimating the term…
A module mounting structure in which a module including a module board and a chip on the module board is mounted on a substrate, the module mounting structure comprises a cover that covers a front surface of the module; a relay connector board between a rear side of the module and the substrate; and wherein the cover, the module board, the relay connector board, and the substrate are in a stacked relationship, wherein the cover includes a cover rectangular portion and a cover bulging portion, wherein the module board includes a board rectangular portion and a board bulging portion, both of which are positioned to correspond with respective positions of the cover rectangular portion and the cover bulging portion.
A module mounting structure in which a module including a module board and a chip on the module board is mounted on a substrate, the module mounting structure comprising:
An electronic apparatus in which a module including a module board and a chip on the module board is mounted on a substrate, the electronic apparatus comprising:
Dependencies are inferred from the claim text.