G11C 5/025
Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
Official title: {Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device (geometrical lay-out of the components in integrated circuits, geometrical lay-out of the components in integrated circuits H10D89/10)}
G11C5/025 (Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device) appears on 3,528 US grants and 3,775 published applications in this corpus.
Search patents in G11C- Granted patents
- 3,528
- Published applications
- 3,775
- Assignees
- 402
- Inventors
- 4,649
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 4 | 0 |
| 1978 | 5 | 0 |
| 1979 | 5 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 9 | 0 |
| 1984 | 5 | 0 |
| 1985 | 5 | 0 |
| 1986 | 7 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 3 | 0 |
| 1991 | 8 | 0 |
| 1992 | 11 | 0 |
| 1993 | 5 | 0 |
| 1994 | 20 | 0 |
| 1995 | 10 | 0 |
| 1996 | 13 | 0 |
| 1997 | 19 | 0 |
| 1998 | 34 | 0 |
| 1999 | 31 | 0 |
| 2000 | 37 | 0 |
| 2001 | 48 | 15 |
| 2002 | 60 | 64 |
| 2003 | 61 | 66 |
| 2004 | 53 | 56 |
| 2005 | 51 | 47 |
| 2006 | 28 | 41 |
| 2007 | 46 | 59 |
| 2008 | 43 | 79 |
| 2009 | 42 | 76 |
| 2010 | 58 | 69 |
| 2011 | 78 | 80 |
| 2012 | 71 | 81 |
| 2013 | 87 | 80 |
| 2014 | 95 | 128 |
| 2015 | 127 | 145 |
| 2016 | 130 | 115 |
| 2017 | 156 | 135 |
| 2018 | 116 | 155 |
| 2019 | 192 | 209 |
| 2020 | 208 | 247 |
| 2021 | 278 | 360 |
| 2022 | 270 | 343 |
| 2023 | 287 | 368 |
| 2024 | 322 | 275 |
| 2025 | 255 | 223 |
| 2026 | 122 | 259 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Power supply circuit, semiconductor device and electronic device6 Oct 2026US 12,755,762 B2SK hynix Inc.
- Method of manufacturing memory device6 Oct 2026US 12,757,394 B2Winbond Electronics Corp.
- Semiconductor devices with wrap-around arrays29 Sep 2026US 12,749,518 B2Micron Technology, Inc.
- Semiconductor memory devices and methods of manufacturing thereof22 Sep 2026US 12,745,388 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Three-dimensional dynamic random access memory1 Sep 2026US 12,727,143 B2Winbond Electronics Corp.
- Reducing capacitive loading of memory system based on switches8 Oct 2026US 2026/0311734 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Sense amplifier driver layout in 3d-dram24 Sep 2026US 2026/0290432 A1Micron Technology, Inc.
- Semiconductor structures in memory devices3 Sep 2026US 2026/0260669 A1Yangtze Memory Technologies Co., Ltd.
- Memory, memory systems and methods for forming memory3 Sep 2026US 2026/0260670 A1Yangtze Memory Technologies Co., Ltd.
- Chiplet system with reconfigurable logical memory macros3 Sep 2026US 2026/0260674 A1Chipletti Ltd
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Datapath architecture for high area efficiency428US 7,054,178 B1Etron Technology, Inc. · 2006
- Semiconductor memory device adopting improved local input/output line precharging scheme421US 8,223,568 B2Samsung Electronics Co., Ltd. · 2012
- Non-volatile semiconductor storage device262US 8,008,710 B2Kabushiki Kaisha Toshiba · 2011
- Semiconductor package having memory devices stacked on logic device251US 7,834,450 B2Samsung Electronics Co., Ltd. · 2010