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US 7,834,450 B2Granted
Semiconductor package having memory devices stacked on logic device
AssigneeSamsung Electronics Co., Ltd.
InventorUk-Song Kang
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Abstract
A semiconductor package includes a base substrate, a logic device with a serializer/deserializer (SerDes), a plurality of odd memory devices disposed on a lower surface of the logic device and operatively stack-connected with the SerDes, and a plurality of even memory devices disposed on an upper surface of the logic device and operatively stack-connected with the SerDes, such that the plurality of odd memory devices and the plurality of even memory devices are connected in parallel by the SerDes.
Claims16
A semiconductor package, comprising:
- a base substrate;
- a logic device disposed on the base substrate, comprising a serializer/deserializer (SerDes) and having an upper surface and an opposing lower surface;
- a plurality of odd memory devices disposed on the lower surface of the logic device, wherein each one of the odd memory devices is operatively stack-connected with the SerDes;
- and
- a plurality of even memory devices disposed on the upper surface of the logic device, wherein each one of the even memory devices is operatively stack-connected with the SerDes,
- wherein the plurality of odd memory devices and the plurality of even memory devices are connected in parallel by the SerDes.
3 more elements
Dependencies are inferred from the claim text.