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US 12,755,762 B2Granted
Power supply circuit, semiconductor device and electronic device
AssigneeSK hynix Inc.
InventorDong Sop Lee
Life of this patent
Estimating the term…
Abstract
Embodiments of the present disclosure may provide a storage device including a semiconductor package on which a memory and a power supply circuit are disposed. The power supply circuit included in the semiconductor package may control supply of an internal driving voltage based on whether an external driving voltage is supplied, and the efficiency of supplying a voltage for driving the semiconductor package may be improved by adjusting supply of the internal driving voltage depending on an operation state of the memory.
Claims19
A semiconductor device comprising:
- a package substrate including a plurality of package balls;
- at least one memory electrically connected to a first driving voltage package ball among the plurality of package balls through a first external voltage interconnection;
- and
- a power supply circuit electrically connected to the first driving voltage package ball through the first external voltage interconnection, electrically connected to the at least one memory through a first internal voltage interconnection, and configured to adjust a voltage state of the first internal voltage interconnection based on a voltage level of the first driving voltage package ball,
- wherein the power supply circuit is configured to:
- generate a first internal driving voltage;
- and
- set the first internal voltage interconnection to a high impedance state when the voltage level of the first driving voltage package ball is equal to or higher than a level of the first internal driving voltage or when the voltage level of the first driving voltage package ball is equal to or higher than a reference level.
5 more elements
An electronic device comprising:
- a semiconductor package;
- and
- a power management circuit configured to supply an external driving voltage through a package ball included in the semiconductor package,
- wherein the semiconductor package comprises:
- at least one memory;
- a power supply circuit configured to supply an internal driving voltage to the at least one memory;
- and
- a first external voltage interconnection electrically connected to the at least one memory and the power supply circuit, and electrically connected to a package ball which is electrically separated from the power management circuit, wherein the external driving voltage is not supplied to the package ball which is electrically connected to the first external voltage interconnection.
5 more elements
An electronic device comprising:
- a semiconductor package;
- and
- a power management circuit configured to supply an external driving voltage through a package ball included in the semiconductor package,
- wherein the semiconductor package comprises:
- at least one memory;
- a power supply circuit configured to supply an internal driving voltage to the at least one memory;
- a first external voltage interconnection electrically connected between a package ball which is electrically connected to the power management circuit and the at least one memory, and electrically connected to the power supply circuit;
- and
- a first internal voltage interconnection electrically connected between the power supply circuit and the at least one memory,
- wherein the power supply circuit is configured to:
- generate a first internal driving voltage;
- and
- set the first internal voltage interconnection to a high impedance state when the voltage level of the package ball electrically connected to the first external voltage interconnection is equal to or higher than a level of the first internal driving voltage or when the voltage level of the package ball electrically connected to the first external voltage interconnection is equal to or higher than a reference level.
10 more elements
Dependencies are inferred from the claim text.