G11C 2207/10
Aspects relating to interfaces of memory device to external buses
G11C2207/10 (Aspects relating to interfaces of memory device to external buses) appears on 1,882 US grants and 1,752 published applications in this corpus.
Search patents in G11C- Granted patents
- 1,882
- Published applications
- 1,752
- Assignees
- 321
- Inventors
- 2,450
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 3 | 0 |
| 1990 | 0 | 0 |
| 1991 | 2 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 4 | 0 |
| 1995 | 8 | 0 |
| 1996 | 5 | 0 |
| 1997 | 10 | 0 |
| 1998 | 7 | 0 |
| 1999 | 13 | 0 |
| 2000 | 28 | 0 |
| 2001 | 66 | 27 |
| 2002 | 69 | 88 |
| 2003 | 88 | 136 |
| 2004 | 113 | 104 |
| 2005 | 72 | 99 |
| 2006 | 97 | 77 |
| 2007 | 93 | 113 |
| 2008 | 59 | 73 |
| 2009 | 78 | 60 |
| 2010 | 73 | 49 |
| 2011 | 68 | 51 |
| 2012 | 60 | 43 |
| 2013 | 36 | 31 |
| 2014 | 40 | 44 |
| 2015 | 40 | 48 |
| 2016 | 58 | 48 |
| 2017 | 60 | 70 |
| 2018 | 70 | 59 |
| 2019 | 84 | 93 |
| 2020 | 88 | 71 |
| 2021 | 75 | 97 |
| 2022 | 80 | 93 |
| 2023 | 86 | 76 |
| 2024 | 68 | 44 |
| 2025 | 49 | 35 |
| 2026 | 21 | 23 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G11C 2207/105Aspects related to pads, pins or terminalsIndexing code596
- G11C 2207/107Serial-parallel conversion of data or prefetchIndexing code546
- G11C 2207/104Embedded memory devicesIndexing code502
- G11C 2207/108Wide data portsIndexing code340
- G11C 2207/102Compression or decompression of data before storageIndexing code51
- G11C 2207/101Analog or multilevel busIndexing code48
Recent patents
- Automatic adaptive signaling over a pin of an integrated circuit device6 Oct 2026US 12,755,767 B2Micron Technology, Inc.
- Memory system and memory chip25 Aug 2026US 12,717,732 B2Etron Technology, Inc.
- NAND die with wire-bond inductive compensation for altered bond wire bandwidth in memory devices25 Aug 2026US 12,718,878 B2SanDisk Technologies LLC
- Reduction of charge injection noise in sense amplifiers of high-speed data interfaces25 Aug 2026US 12,719,413 B2Parade Technologies, Ltd.
- Optical communication for memory disaggregation in high performance computing25 Aug 2026US 12,721,218 B2Google Inc.
- Semiconductor device1 Oct 2026US 2026/0301827 A1Kioxia Corporation
- Variable memory access granularity16 Jul 2026US 2026/0202996 A1Rambus Inc.
- Multi-channel memory16 Jul 2026US 2026/0204303 A1SK hynix Inc.
- Multiplexing distinct signals on a single pin of a memory device16 Jul 2026US 2026/0205332 A1Lodestar Licensing Group LLC
- Multi-chip package and memory system2 Jul 2026US 2026/0188381 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Apparatus for synchronously generating clock signals in a data processing system430US 5,243,703 ARambus Inc. · 1993
- Semiconductor integrated circuit device having a memory and an operational unit integrated therein429US 5,379,257 AMitsubishi Denki Kabushiki Kaisha · 1995
- Data amplifier having reduced data lines and/or higher data rates429US 6,950,898 B2Micron Technology, Inc. · 2005
- Digit line comparison circuits429US 8,279,683 B2Micron Technology, Inc. · 2012
- Read circuitry for an integrated circuit having memory cells and/or a memory cell array, and method of operating same426US 7,957,206 B2Micron Technology, Inc. · 2011