G11C 2207/105
Aspects related to pads, pins or terminals
G11C2207/105 (Aspects related to pads, pins or terminals) appears on 596 US grants and 607 published applications in this corpus.
Search patents in G11C- Granted patents
- 596
- Published applications
- 607
- Assignees
- 118
- Inventors
- 899
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 12 | 0 |
| 2001 | 11 | 5 |
| 2002 | 6 | 17 |
| 2003 | 16 | 33 |
| 2004 | 29 | 30 |
| 2005 | 16 | 28 |
| 2006 | 22 | 19 |
| 2007 | 21 | 14 |
| 2008 | 13 | 12 |
| 2009 | 19 | 15 |
| 2010 | 14 | 13 |
| 2011 | 16 | 12 |
| 2012 | 16 | 13 |
| 2013 | 8 | 8 |
| 2014 | 10 | 17 |
| 2015 | 14 | 23 |
| 2016 | 26 | 17 |
| 2017 | 24 | 33 |
| 2018 | 27 | 20 |
| 2019 | 35 | 35 |
| 2020 | 32 | 35 |
| 2021 | 30 | 50 |
| 2022 | 43 | 54 |
| 2023 | 45 | 39 |
| 2024 | 33 | 27 |
| 2025 | 29 | 23 |
| 2026 | 11 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Automatic adaptive signaling over a pin of an integrated circuit device6 Oct 2026US 12,755,767 B2Micron Technology, Inc.
- NAND die with wire-bond inductive compensation for altered bond wire bandwidth in memory devices25 Aug 2026US 12,718,878 B2SanDisk Technologies LLC
- Optical communication for memory disaggregation in high performance computing25 Aug 2026US 12,721,218 B2Google Inc.
- Impedance adjustment circuit and semiconductor apparatus including the impedance adjustment circuit21 Jul 2026US 12,689,374 B2SK hynix Inc.
- Flexible configuration of memory module data width26 May 2026US 12,639,219 B2Intel Corporation
- Variable memory access granularity16 Jul 2026US 2026/0202996 A1Rambus Inc.
- Multi-chip package and memory system2 Jul 2026US 2026/0188381 A1Samsung Electronics Co., Ltd.
- Semiconductor device and method for fabricating the same18 Jun 2026US 2026/0173345 A1SK hynix Inc.
- Contact structure for wordlines in memory circuits23 Apr 2026US 2026/0112394 A1Samsung Electronics Co., Ltd.
- Multi-die Memory Package with Individually Accessible Command/Address Pins23 Apr 2026US 2026/0112406 A1Advanced Micro Devices, Inc.
Most cited
By later US patents
- Apparatus for synchronously generating clock signals in a data processing system430US 5,243,703 ARambus Inc. · 1993
- Integrated circuit I/O using high performance bus interface325US 5,319,755 ARambus Inc. · 1994
- Memory circuitry having bus interface for receiving information in packets and access time registers282US 5,606,717 ARambus Inc. · 1997
- Memory module having memory devices containing internal device ID registers and method of initializing same261US 5,928,343 ARambus Inc. · 1999
- Memory device supporting a dynamically configurable core organization220US 6,889,304 B2Rambus Inc. · 2005