G11C 2207/107
Serial-parallel conversion of data or prefetch
G11C2207/107 (Serial-parallel conversion of data or prefetch) appears on 546 US grants and 534 published applications in this corpus.
Search patents in G11C- Granted patents
- 546
- Published applications
- 534
- Assignees
- 116
- Inventors
- 663
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1983 | 1 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 13 | 9 |
| 2002 | 12 | 13 |
| 2003 | 19 | 44 |
| 2004 | 34 | 28 |
| 2005 | 19 | 26 |
| 2006 | 26 | 22 |
| 2007 | 27 | 37 |
| 2008 | 17 | 32 |
| 2009 | 27 | 21 |
| 2010 | 26 | 19 |
| 2011 | 20 | 19 |
| 2012 | 18 | 11 |
| 2013 | 14 | 13 |
| 2014 | 19 | 16 |
| 2015 | 12 | 17 |
| 2016 | 27 | 20 |
| 2017 | 18 | 20 |
| 2018 | 23 | 23 |
| 2019 | 35 | 37 |
| 2020 | 35 | 25 |
| 2021 | 27 | 25 |
| 2022 | 17 | 18 |
| 2023 | 23 | 20 |
| 2024 | 20 | 6 |
| 2025 | 9 | 9 |
| 2026 | 2 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Memory system and memory chip25 Aug 2026US 12,717,732 B2Etron Technology, Inc.
- Apparatus for page-copy data accessing27 Jan 2026US 12,537,049 B2Piecemakers Technology, Inc.
- Double fetch for long burst length memory data transfer3 Jun 2025US 12,321,634 B2Intel Corporation
- Memory organization for multi-mode support8 Apr 2025US 12,271,597 B2Advanced Micro Devices, Inc.
- Semiconductor memory devices having efficient serializers therein for transferring data25 Feb 2025US 12,237,049 B2Samsung Electronics Co., Ltd.
- Multi-channel memory16 Jul 2026US 2026/0204303 A1SK hynix Inc.
- Data sending circuit, data receiving circuit, and electronic device30 Apr 2026US 2026/0121660 A1CXMT Corporation
- Through silicon via (tsv) bus compression-redistribution die for high-bandwidth three-dimensional dynamic random-access memory (3d dram) for flexible processing unit (pu) placement, improved thermal, and known good die (kgd) dram placement for high-yield5 Mar 2026US 2026/0068182 A1QUALCOMM Incorporated
- Memory device, memory controller, and memory system including the same8 Jan 2026US 2026/0010292 A1Samsung Electronics Co., Ltd.
- Decision feedback equalizer with variable gain amplifier calibration25 Dec 2025US 2025/0392276 A1Micron Technology, Inc.
Most cited
By later US patents
- Data amplifier having reduced data lines and/or higher data rates429US 6,950,898 B2Micron Technology, Inc. · 2005
- Apparatus for data recovery in a synchronous chip-to-chip system156US 6,570,944 B2Rambus Inc. · 2003
- DDR II write data capture calibration112US 6,691,214 B1Micron Technology, Inc. · 2004
- Memory system and method using stacked memory device dice, and system using the memory system103US 7,855,931 B2Micron Technology, Inc. · 2010
- Calibrating data strobe signal using adjustable delays with feedback102US 6,316,980 B1Intel Corporation · 2001