Back to results
US 12,271,597 B2Granted
Memory organization for multi-mode support
AssigneesATI Technologies ULC, Advanced Micro Devices, Inc.
InventorsXuan Chen, Ross V. La Fetra, Michael John Litt
Life of this patent
Estimating the term…
Abstract
A memory package includes first, second, third, and fourth channels arranged consecutively in a clockwise direction on the memory package, each of the first, second, third, and fourth channels having access circuitry and memory arrays. In a first mode, the first channel controls access to the memory arrays in the second channel and the fourth channel controls access to the memory arrays in the third channel.
Claims15
A layout of a circuit board, comprising:
- a first memory package and a second memory package, each comprising:
- first, second, third, and fourth channels arranged consecutively in a clockwise direction, each of the first, second, third, and fourth channels having memory arrays,
- wherein the first and fourth channels comprise initiator channels and exhibit vertical symmetry around a horizontal middle line;
- the second and third channels comprise target channels and exhibit vertical symmetry around the horizontal middle line;
- the first and second channels exhibit horizontal symmetry around a vertical center line;
- and
- the third and fourth channels further exhibit horizontal symmetry around the vertical center line,
- wherein in a first mode, the initiator channels and the target channels are independently accessible, and in a second mode, the first channel controls accesses to the memory arrays in the second channel and the fourth channel controls access to the memory arrays in the third channel.
5 more elements
Dependencies are inferred from the claim text.