G03F 7/037
The binders being polyamides or polyimides
Official title: the binders being polyamides or polyimides
G03F7/037 (The binders being polyamides or polyimides) appears on 252 US grants and 304 published applications in this corpus.
Search patents in G03F- Granted patents
- 252
- Published applications
- 304
- Assignees
- 93
- Inventors
- 599
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 2 | 0 |
| 1980 | 3 | 0 |
| 1981 | 2 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 4 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 3 | 0 |
| 1998 | 3 | 0 |
| 1999 | 8 | 0 |
| 2000 | 12 | 0 |
| 2001 | 5 | 1 |
| 2002 | 2 | 5 |
| 2003 | 3 | 2 |
| 2004 | 2 | 10 |
| 2005 | 3 | 5 |
| 2006 | 5 | 5 |
| 2007 | 2 | 3 |
| 2008 | 3 | 6 |
| 2009 | 4 | 1 |
| 2010 | 3 | 14 |
| 2011 | 4 | 12 |
| 2012 | 7 | 8 |
| 2013 | 9 | 3 |
| 2014 | 9 | 4 |
| 2015 | 4 | 7 |
| 2016 | 6 | 10 |
| 2017 | 6 | 5 |
| 2018 | 5 | 26 |
| 2019 | 13 | 20 |
| 2020 | 16 | 29 |
| 2021 | 12 | 21 |
| 2022 | 11 | 23 |
| 2023 | 16 | 19 |
| 2024 | 11 | 17 |
| 2025 | 18 | 26 |
| 2026 | 7 | 22 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, photosensitive sheet, cured film, method for producing cured film, electronic component, antenna element, semiconductor package, and display device1 Sep 2026US 12,724,345 B2Toray Industries, Inc.
- Photosensitive polyimide compositions9 Jun 2026US 12,650,646 B2Promerus, LLC
- Unsaturated cyclic anhydride end capped polyimides and polyamic acids and photosensitive compositions thereof2 Jun 2026US 12,643,981 B2Promerus, LLC
- Positive photosensitive resin composition5 May 2026US 12,619,144 B2Dongjin Semichem Co., Ltd.
- Photosensitive resin composition and method for producing cured relief pattern28 Apr 2026US 12,613,465 B2Asahi Kasei Kabushiki Kaisha
- Method for forming insulating film, and photosensitive resin composition1 Oct 2026US 2026/0299417 A1Resonac Corporation
- Photosensitive resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device27 Aug 2026US 2026/0251975 A9FUJIFILM Corporation
- Photosensitive resin composition, method for producing cured relief pattern, cured film, and semiconductor device20 Aug 2026US 2026/0244101 A1Asahi Kasei Kabushiki Kaisha
- Negative photosensitive resin composition, dry film, cured product, and electronic component6 Aug 2026US 2026/0227694 A1Taiyo Holdings Co., Ltd.
- Soluble polymer compound, method for producing soluble polymer compound, resin composition, resin composition film, cured film, and electronic component23 Jul 2026US 2026/0211329 A1Toray Industries, Inc.
Most cited
By later US patents
- Photosensitive polyimide precursor compositions and process for preparing same65US 5,310,862 AToray Industries, Inc. · 1994
- Photosensitive compositions54US 4,243,743 AToray Industries, Inc. · 1981
- Developer for photosensitive polyimide resin composition51US 6,403,289 B1Fujitsu Limited · 2002
- Photopolymerizable compositions containing prepolymers with olefin double bonds and titanium metallocene photoinitiators46US 4,548,891 ACiba-Geigy Corporation · 1985
- Photosensitive polyimide polymer compositions46US 4,803,147 AHoechst Celanese Corporation · 1989