Photosensitive compositions
AssigneeToray Industries, Inc.
InventorsHiroo Hiramoto, Masuichi Eguchi
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Abstract
This invention relates to a photosensitive composition comprising a precursor of a heat resistant polymer having carboxylic groups and a compound having a photosensitive olefinic double bond and an amino or quaternary ammonium salt. The photosensitive composition can give highly heat resistant relief patterns with good edge sharpness, good mechanical and chemical properties as well as good insulating properties. The heat resistant relief patterns obtained from the composition of this invention are especially useful as insulating, passivation or protective coatings in semiconductor devices.
Claims14
A photosensitive composition comprising
- (1) a polymer [I] containing a repeating unit [II] of the formula ##STR13## wherein R.sub.1 and R.sub.2 each comprise a carbocyclic or heterocyclic nucleus;
- R.sub.3 is selected from the group consisting of hydrogen, an alkali metal ion and an ammonium ion;
- n is 1 or 2, and COOR.sub.3 is located in an ortho or peri position with respect to the amide linkage.
- (2) an organic compound [III] having a photo- di- or polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt.
Dependencies are inferred from the claim text.