Back to results
US 2026/0244101 A1Published application
Photosensitive resin composition, method for producing cured relief pattern, cured film, and semiconductor device
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsKohei MURAKAMI, Kazuhisa YAMOTO, Yuka SATO, Satoshi SHIBUI
Life of this patent
Estimating the term…
Abstract
The present disclosure relates to a photosensitive resin composition, a method for producing a cured relief pattern, a cured film, and a semiconductor device. The photosensitive resin composition comprises: (A) a polyimide (A1) having an aromatic ring in a side chain and/or a polyimide (A2) having a structure represented by general formula (1); (B) a solvent; and (C) a photopolymerization initiator.
Claims31
A photosensitive resin composition comprising:
- (A) a polyimide of the following (A1) and/or (A2):
- (A1) a polyimide having an aromatic ring in a side chain, and
- (A2) a polyimide having a structure represented by the following general formula (1):
- wherein W is an aromatic ring or aliphatic ring which may have any substituent other than Z1 (in which those having an aromatic ring are excluded), at least two Z1 of a plurality of Z1 form a main chain together with W, the remaining Z1 is a hydrogen atom, and R1 is a hydrogen atom or a monovalent organic group (in which those having an aromatic ring are excluded),
- (B) a solvent, and
- (C) a photopolymerization initiator.
3 more elements
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
(canceled)
Dependencies are inferred from the claim text.