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US 2026/0227694 A1Published application
Negative photosensitive resin composition, dry film, cured product, and electronic component
AssigneeTaiyo Holdings Co., Ltd.
InventorsAyano OKUDA, Daiki YUKIMORI, Go INOUE, Kaho SHIBASAKI, Kenyu SUGITA, Nobuhiro ISHIKAWA
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Abstract
An object of the present invention is to provide a new negative photosensitive resin composition having excellent resolution without using a resin component that may be subject to PFAS regulations. Provided is a negative photosensitive resin composition containing a polyhydroxyamide compound containing a structural unit represented by Formula (1), a crosslinking agent, and a photoacid generator.
Claims8
A negative photosensitive resin composition comprising:
- a polyhydroxyamide compound containing a structural unit represented by Formula (1):
- a crosslinking agent;
- and
- a photoacid generator.
1 more element
Dependencies are inferred from the claim text.