Positive photosensitive resin composition

A positive photosensitive resin composition comprising:

• a polymer resin comprising i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 2, and iii) 0 to 20 wt. % of a polyimide precursor having a structural unit represented by Formula 3;
• 5 to 50 parts by weight of a quinonediazide compound per 100 parts by weight of the polymer resin;
• and
• 100 to 2,000 parts by weight of a solvent per 100 parts by weight of the polymer resin,
• wherein R1 and R2 are each independently an organic group having 5 to 30 carbon atoms, wherein in the organic group, hydrogen can be substituted with a hydroxyl group (OH), methyl, or fluorine, the methylene group can be substituted with oxygen or nitrogen, and R3 is a substituent derived from epoxy.