G03F 7/0044
Involving an interaction between the metallic and non-metallic component
Official title: {involving an interaction between the metallic and non-metallic component, e.g. photodope systems}
G03F7/0044 (Involving an interaction between the metallic and non-metallic component) appears on 42 US grants and 67 published applications in this corpus.
Search patents in G03F- Granted patents
- 42
- Published applications
- 67
- Assignees
- 33
- Inventors
- 188
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 4 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 2 |
| 2018 | 0 | 7 |
| 2019 | 0 | 8 |
| 2020 | 6 | 3 |
| 2021 | 3 | 6 |
| 2022 | 3 | 5 |
| 2023 | 4 | 7 |
| 2024 | 2 | 14 |
| 2025 | 5 | 9 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive composition8 Sep 2026US 12,730,376 B2Tokyo Ohka Kogyo.Co., Ltd.
- Semiconductor photoresist compositions and methods of forming patterns using the composition1 Sep 2026US 12,724,342 B2Samsung SDI.Co., Ltd.
- Methods and materials for metallic photoresist25 Aug 2026US 12,717,229 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method of manufacturing semiconductor device9 Jun 2026US 12,653,002 B2Samsung Electronics Co., Ltd.
- Semiconductor photoresist composition and method of forming patterns using the composition2 Jun 2026US 12,645,141 B2Samsung SDI.Co., Ltd.
- Resist composition and patterning process8 Oct 2026US 2026/0310074 A1Shin-Etsu Chemical Co., Ltd.
- Semiconductor photoresist composition and method of forming patterns using the composition3 Sep 2026US 2026/0259495 A1Samsung SDI.Co., Ltd.
- Pattern formation method using resist composition25 Jun 2026US 2026/0177923 A1Samsung Electronics Co., Ltd.
- Photoresist compositions and methods of manufacturing semiconductor devices using the same23 Apr 2026US 2026/0110961 A1Samsung Electronics Co., Ltd.
- Dose reduction bottom anti-reflective coating for metallic photoresist27 Nov 2025US 2025/0362607 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- High resolution, multi-layer resist for microlithography and method therefor261US 5,314,772 AArizona Board of Regents · 1994
- Pattern-forming process205US 4,320,191 ANippon Telegraph & Telephone Public Corporation · 1982
- Surface sensitized chalcogenide product and process for making and using the same179US 4,316,946 AIonomet Company, Inc. · 1982
- Photoinduced migration of silver into chalcogenide layer20US 4,276,368 ABell Telephone Laboratories, Incorporated · 1981
- Pattern-forming materials having a radiation sensitive chalcogenide layer and a method of forming patterns with such materials19US 4,127,414 ANippon Telegraph & Telephone Public Corporation · 1978