G02B 6/4232
Using the surface tension of fluid solder to align the elements
Official title: {using the surface tension of fluid solder to align the elements, e.g. solder bump techniques (flip-chip mounting techniques in assembly of semiconductor devices H10W72/072)}
G02B6/4232 (Using the surface tension of fluid solder to align the elements) appears on 493 US grants and 436 published applications in this corpus.
Search patents in G02B- Granted patents
- 493
- Published applications
- 436
- Assignees
- 219
- Inventors
- 973
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 8 | 0 |
| 1996 | 13 | 0 |
| 1997 | 19 | 0 |
| 1998 | 10 | 0 |
| 1999 | 15 | 0 |
| 2000 | 21 | 0 |
| 2001 | 9 | 8 |
| 2002 | 23 | 35 |
| 2003 | 33 | 49 |
| 2004 | 23 | 28 |
| 2005 | 27 | 22 |
| 2006 | 18 | 25 |
| 2007 | 21 | 15 |
| 2008 | 21 | 12 |
| 2009 | 9 | 11 |
| 2010 | 13 | 10 |
| 2011 | 5 | 6 |
| 2012 | 9 | 7 |
| 2013 | 8 | 15 |
| 2014 | 10 | 10 |
| 2015 | 8 | 12 |
| 2016 | 15 | 17 |
| 2017 | 21 | 24 |
| 2018 | 19 | 22 |
| 2019 | 18 | 15 |
| 2020 | 19 | 20 |
| 2021 | 14 | 11 |
| 2022 | 11 | 12 |
| 2023 | 10 | 18 |
| 2024 | 8 | 14 |
| 2025 | 8 | 12 |
| 2026 | 7 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photonic semiconductor device and method of manufacture18 Aug 2026US 12,710,607 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Optoelectronic package11 Aug 2026US 12,704,677 B2Advanced Semiconductor Engineering, Inc.
- Techniques for laser alignment in photonic integrated circuits23 Jun 2026US 12,665,382 B2MACOM Technology Solutions Holdings, Inc.
- Systems and methods for enabling an optics based compute system associated with transmission and reception28 Apr 2026US 12,615,090 B2Lightspeed Photonics Private Limited
- Bonding structure10 Mar 2026US 12,573,810 B2Teknologian tutkimuskeskus VTT Oy
- Optical devices and methods of manufacture14 May 2026US 2026/0133388 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Fiber Attach Enabled Wafer Level Fanout23 Apr 2026US 2026/0110845 A1Ayar Labs, Inc.
- Opto-electronic assembly for chemical sensors23 Apr 2026US 2026/0110857 A1Cardiac Pacemakers, Inc.
- Improved Light Source Integration19 Feb 2026US 2026/0050130 A1Sentea NV
- Light Modulation Device29 Jan 2026US 2026/0029595 A1Nippon Telegraph and Telephone Corporation
Most cited
By later US patents
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011
- Receptacle for connecting parallel fiber optic cables to a multichip module280US 5,499,311 AInternational Business Machines Corporation · 1996