Optical devices and methods of manufacture

An optical device comprising:

• a substrate;
• an optical package bonded to the substrate through a plurality of connectors formed on a base surface of the optical package, wherein the optical package comprises an optical die and an electronic die connected to the optical die, and the optical die comprises at least a waveguide and the electronic die comprises at least an active device;
• an underfill material disposed between the optical package and the substrate and surrounding the plurality of connectors, wherein the underfill material is disposed within a first region of the base surface and a second region of the optical package adjacent to the first region that is free of the underfill material;
• and
• a fiber array unit optically connected to the optical package.

An optical device comprising:

• a substrate;
• an optical package bonded to the substrate through a plurality of connectors formed on a base surface of the optical package, wherein the optical package comprises an optical die and an electronic die connected to the optical die, and the optical die comprises at least a waveguide and the electronic die comprises at least an active device;
• an underfill material disposed between the optical package and the substrate and surrounding the plurality of connectors, wherein a first end of the underfill material is located under the base surface of the optical package;
• and
• a fiber array unit optically connected to the optical package.