Techniques for laser alignment in photonic integrated circuits
AssigneeMACOM Technology Solutions Holdings, Inc.
InventorsRoe Hemenway, Cristian Stagarescu, Daniel Meerovich, Malcolm R. Green, Wolfgang Parz, Jichi Ma, Richard Robert Grzybowski, Nathan Bickel
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Abstract
Techniques for efficient alignment of a semiconductor laser in a Photonic Integrated Circuit (PIC) are disclosed. In some embodiments, a photonic integrated circuit (PIC) may include a semiconductor laser that includes a laser mating surface, and a substrate that includes a substrate mating surface. A shape of the laser mating surface and a shape of the substrate mating surface may be configured to align the semiconductor laser with the substrate in three dimensions.
Claims21
A semiconductor laser, comprising:
- a laser mating surface, the laser mating surface comprising a tapered mating surface and a laser facet, the laser facet being completely set back to a position between where the tapered mating surface is narrower and the tapered mating surface is wider.
A photonic integrated circuit (PIC), comprising:
- a semiconductor laser, the semiconductor laser comprising a laser mating surface, the laser mating surface comprising a tapered laser mating surface and a laser facet for exiting a laser beam, the laser facet being positioned between where the tapered laser mating surface is narrower and the tapered laser mating surface is wider;
- and
- a substrate, the substrate comprising a tapered substrate mating surface and a waveguide for receiving the laser beam, a leading edge of the waveguide being completely set back to a position between where the tapered substrate mating surface is narrower and the tapered substrate mating surface is wider.
A photonic integrated circuit (PIC) substrate, comprising:
- a tapered substrate mating surface;
- and
- a waveguide for receiving a laser beam from a semiconductor laser, a leading edge of the waveguide being completely set back to a position between where the tapered substrate mating surface is narrower and the tapered substrate mating surface is wider.
Dependencies are inferred from the claim text.