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US 8,049,161 B2Granted
Optoelectronic component with flip-chip mounted optoelectronic device
AssigneeSamsung Electronics Co., Ltd.
InventorsDavid W. Sherrer, Noel A. Heiks
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Abstract
Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components.
Claims46
An optoelectronic component, comprising:
- a substrate comprising a first surface and a second surface opposite the first surface;
- at least one hole through the substrate, extending from the first surface to the second surface;
- an electrical conductor member which is disposed on the first surface and the second surface and extends from the first surface to the second surface through the at least one hole;
- at least one light emitting diode flip-chip mounted to the electrical conductor member on the first surface;
- a heat sink which is connected to the substrate, and conducts heat away from the light emitting diode;
- and
- an encapsulant disposed over the light emitting diode, wherein the encapsulant forms a surface over the light emitting diode.
4 more elements
An optoelectronic component, comprising:
- a substrate comprising a front surface, a back surface and at least one via hole formed through the substrate extending from the front surface to the back surface;
- an optoelectronic device flip-chip mounted on the front surface;
- an electrical conductor member which is disposed on the front surface and the back surface and extending from the front surface to the back surface through the at least one via hole;
- and
- an encapsulant disposed over the optoelectronic device, wherein the encapsulant forms a surface over the optoelectronic device.
2 more elements
Dependencies are inferred from the claim text.