Light Modulation Device
AssigneeNippon Telegraph and Telephone Corporation
InventorsYoshihiro Ogiso, Mitsuteru Ishikawa, Josuke Ozaki
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Abstract
An object of the present invention is to provide a light modulation device capable of preventing deformation of an optical modulation element due to warpage of a TEC. The light modulation device of the present invention includes an optical modulation element that is flip-chip connected on a high-frequency wiring substrate, a temperature controller that controls a temperature of the optical modulation element, a heat spreader that is connected to the temperature controller, and a deformable adhesive layer that connects the temperature controller and the optical modulation element on a surface different from the heat spreader and is deformable in response to stress caused by deformation of the temperature controller
Claims8
A light modulation device, comprising:
- an optical modulation element being flip-chip connected on a high-frequency wiring substrate;
- a temperature controller configured to control a temperature of the optical modulation element;
- a heat spreader being connected to the temperature controller;
- and
- a deformable adhesive layer configured to connect the temperature controller and the optical modulation element on a surface different from the heat spreader, the deformable adhesive layer being deformable in response to stress caused by deformation of the temperature controller.
Dependencies are inferred from the claim text.