G02B 6/4201
Packages
Official title: {Packages, e.g. shape, construction, internal or external details}
G02B6/4201 (Packages) appears on 17,032 US grants and 16,834 published applications in this corpus.
Search patents in G02B- Granted patents
- 17,032
- Published applications
- 16,834
- Assignees
- 3,558
- Inventors
- 24,270
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 16 | 0 |
| 1978 | 28 | 0 |
| 1979 | 30 | 0 |
| 1980 | 51 | 0 |
| 1981 | 44 | 0 |
| 1982 | 29 | 0 |
| 1983 | 34 | 0 |
| 1984 | 44 | 0 |
| 1985 | 45 | 0 |
| 1986 | 44 | 0 |
| 1987 | 112 | 0 |
| 1988 | 155 | 0 |
| 1989 | 152 | 0 |
| 1990 | 132 | 0 |
| 1991 | 193 | 0 |
| 1992 | 173 | 0 |
| 1993 | 156 | 0 |
| 1994 | 201 | 0 |
| 1995 | 176 | 0 |
| 1996 | 187 | 0 |
| 1997 | 209 | 0 |
| 1998 | 250 | 0 |
| 1999 | 264 | 0 |
| 2000 | 279 | 0 |
| 2001 | 341 | 129 |
| 2002 | 456 | 736 |
| 2003 | 557 | 895 |
| 2004 | 618 | 783 |
| 2005 | 628 | 732 |
| 2006 | 589 | 548 |
| 2007 | 554 | 485 |
| 2008 | 468 | 384 |
| 2009 | 389 | 433 |
| 2010 | 344 | 418 |
| 2011 | 268 | 426 |
| 2012 | 254 | 422 |
| 2013 | 364 | 516 |
| 2014 | 425 | 610 |
| 2015 | 577 | 630 |
| 2016 | 685 | 696 |
| 2017 | 723 | 703 |
| 2018 | 647 | 749 |
| 2019 | 784 | 799 |
| 2020 | 756 | 834 |
| 2021 | 637 | 795 |
| 2022 | 668 | 857 |
| 2023 | 601 | 819 |
| 2024 | 642 | 833 |
| 2025 | 607 | 913 |
| 2026 | 418 | 689 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G02B 6/4204The coupling comprising intermediate optical elements8,683
- G02B 6/4219Mechanical fixtures for holding or positioning the elements relative to each other5,213
- G02B 6/4274Electrical aspects3,569
- G02B 6/4246Bidirectionally operating package structures3,456
- G02B 6/4249Comprising arrays of active devices and fibres2,566
- G02B 6/4256Details of housings2,054
- G02B 6/4266Thermal aspects, temperature control or temperature monitoring1,669
- G02B 6/4202For coupling an active element with fibres without intermediate optical elements1,360
All 15 subgroupsShow fewer
- G02B 6/4248Feed-through connections for the hermetical passage of fibres through a package wall663
- G02B 6/4286Optical modules with optical power monitoring604
- G02B 6/4251Sealed packages575
- G02B 6/4287Optical modules with tapping or launching means through the surface of the300
- G02B 6/4255Moulded or casted packages238
- G02B 6/4216Incorporating polarisation-maintaining fibres134
- G02B 6/4285Optical modules characterised by a connectorised pigtail131
Recent patents
- Polarization independent optoelectronic device and method6 Oct 2026US 12,754,067 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Sub-surface compound microlenses6 Oct 2026US 12,754,349 B2Intel Corporation
- Electro-optical circuits with modular switchable photonic interface6 Oct 2026US 12,754,376 B2Intel Corporation
- Three-dimensional micro-optical systems6 Oct 2026US 12,754,381 B2X-Celeprint Limited
- Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system6 Oct 2026US 12,754,382 B2Huawei Technologies Co., Ltd.
- Detachable optical coupler with curved mirror8 Oct 2026US 2026/0309922 A1Intel Corporation
- Optical bridge interface with evanescent coupling8 Oct 2026US 2026/0309931 A1Intel Corporation
- Optical connector with kinematic coupling8 Oct 2026US 2026/0309932 A1Cisco Technology, Inc.
- Light waveguide component and method for forming the same8 Oct 2026US 2026/0309933 A1Himax Technologies Limited
- Optical coupler with 3d stacked waveguides8 Oct 2026US 2026/0309934 A1Intel Corporation
Most cited
By later US patents
- Ultra-small optical probes, imaging optics, and methods for using same773US 6,445,939 B1LightLab Imaging, Inc. · 2002
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011