G02B 6/4256
Details of housings
Official title: {Details of housings}
G02B6/4256 (Details of housings) appears on 2,054 US grants and 2,230 published applications in this corpus.
Search patents in G02B- Granted patents
- 2,054
- Published applications
- 2,230
- Assignees
- 649
- Inventors
- 4,147
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 3 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 5 | 0 |
| 1988 | 6 | 0 |
| 1989 | 3 | 0 |
| 1990 | 6 | 0 |
| 1991 | 10 | 0 |
| 1992 | 7 | 0 |
| 1993 | 10 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 11 | 0 |
| 1998 | 29 | 0 |
| 1999 | 17 | 0 |
| 2000 | 29 | 0 |
| 2001 | 47 | 21 |
| 2002 | 54 | 82 |
| 2003 | 70 | 128 |
| 2004 | 74 | 76 |
| 2005 | 74 | 68 |
| 2006 | 70 | 53 |
| 2007 | 53 | 43 |
| 2008 | 40 | 29 |
| 2009 | 27 | 25 |
| 2010 | 27 | 22 |
| 2011 | 17 | 48 |
| 2012 | 24 | 63 |
| 2013 | 44 | 86 |
| 2014 | 54 | 78 |
| 2015 | 81 | 123 |
| 2016 | 127 | 117 |
| 2017 | 145 | 131 |
| 2018 | 111 | 139 |
| 2019 | 157 | 123 |
| 2020 | 114 | 130 |
| 2021 | 94 | 115 |
| 2022 | 100 | 104 |
| 2023 | 75 | 108 |
| 2024 | 76 | 102 |
| 2025 | 75 | 108 |
| 2026 | 61 | 108 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system6 Oct 2026US 12,754,382 B2Huawei Technologies Co., Ltd.
- Optical module6 Oct 2026US 12,754,383 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Optical module29 Sep 2026US 12,748,272 B2Sumitomo Electric Industries, Ltd.
- Fiber-based transmitter and receiver channels of light detection and ranging systems22 Sep 2026US 12,742,860 B2Seyond, Inc.
- Optical ferrules8 Sep 2026US 12,730,269 B23M Innovative Properties Company
- Optical connection module1 Oct 2026US 2026/0299218 A1Centera Photonics Inc.
- Fiber optic cable structure including foldable fiber optic cable with coupler therefor and related method1 Oct 2026US 2026/0299226 A1GLOBALFOUNDRIES U. S. Inc.
- Processor package integrated with optical engine, electronic device including the processor package, and method of manufacturing the processor package1 Oct 2026US 2026/0299227 A1Samsung Electronics Co., Ltd.
- Next generation fiber optic module1 Oct 2026US 2026/0299228 A1
- Optical module with photonic chip and carrier1 Oct 2026US 2026/0299230 A1Global Technology Inc.
Most cited
By later US patents
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011
- Optical ready substrates300US 7,110,629 B2APPLIED Materials.Inc. · 2006