Processor package integrated with optical engine, electronic device including the processor package, and method of manufacturing the processor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHeejin CHOI, Woosung KIM
Life of this patent
Estimating the term…
Abstract
A processor package includes an interposer, a memory on the interposer, a processor on the interposer, and an optical engine on the interposer, where the optical engine includes a photonic integrated circuit (PIC) chip including circuit elements configured for photoelectric conversion, and a coupling structure on the PIC chip and configured to provide a light input/output path, and the coupling structure includes, on an upper portion thereof, at least one groove structure configured for alignment with a fiber array unit (FAU).
Claims20
A processor package comprising:
- an interposer;
- a memory on the interposer;
- a processor on the interposer;
- and
- an optical engine on the interposer,
- wherein the optical engine comprises:
- a photonic integrated circuit (PIC) chip comprising circuit elements configured for photoelectric conversion;
- and
- a coupling structure on the PIC chip and configured to provide a light input/output path, and
- wherein the coupling structure comprises, on an upper portion thereof, at least one groove structure configured for alignment with a fiber array unit (FAU).
An electronic device comprising:
- a processor package;
- a fiber array unit (FAU);
- and
- an output interface connected to the processor package,
- wherein the processor package comprises:
- an interposer;
- a memory on the interposer;
- a processor on the interposer;
- and
- an optical engine on the interposer, and
- wherein the optical engine comprises:
- a photonic integrated circuit (PIC) chip comprising circuit elements configured for photoelectric conversion;
- and
- a coupling structure on the PIC chip and configured to provide a light input/output path, and
- wherein the coupling structure comprises, on an upper portion thereof, at least one groove structure that aligns with the FAU.
A method of manufacturing a processor package, the method comprising:
- providing a coupling structure comprising at least one groove structure;
- forming an optical engine by arranging, on a photonic integrated circuit (PIC) chip, the coupling structure and an electronic integrated circuit (EIC) chip, the PIC chip comprising circuit elements configured for photoelectric conversion and the EIC chip being configured to drive the circuit elements;
- depositing a protective film on the coupling structure;
- applying a mold material to regions of the coupling structure, the EIC chip, and the coupling structure;
- exposing the at least one groove structure by removing the protective film;
- and
- providing the optical engine on an interposer.
Dependencies are inferred from the claim text.