Optoelectronic component with encapsulant
AssigneeRohm and Haas Electronic Materials LLC
InventorsDavid W. Sherrer, Noel A. Heiks
Life of this patent
Estimating the term…
Abstract
Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsulant provides an optical surface.
Claims9
An optoelectronic component, comprising a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench flush to the front surface, wherein the encapsulant provides an optical surface.
An optoelectronic component, comprising a planar substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, an encapsulant covering the optoelectronic device, and an optical element inserted into the encapsulant for focusing or reflecting light, or for altering the light transmission qualities of the optoelectronic component.
Dependencies are inferred from the claim text.