G02B 6/426
Mounting, engaging or coupling of the package to a board, a frame
Official title: {mounting, engaging or coupling of the package to a board, a frame or a panel}
G02B6/426 (Mounting, engaging or coupling of the package to a board, a frame) appears on 907 US grants and 980 published applications in this corpus.
Search patents in G02B- Granted patents
- 907
- Published applications
- 980
- Assignees
- 367
- Inventors
- 2,026
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 3 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 13 | 0 |
| 1999 | 9 | 0 |
| 2000 | 12 | 0 |
| 2001 | 20 | 6 |
| 2002 | 26 | 36 |
| 2003 | 31 | 58 |
| 2004 | 34 | 27 |
| 2005 | 38 | 26 |
| 2006 | 31 | 33 |
| 2007 | 21 | 22 |
| 2008 | 25 | 19 |
| 2009 | 18 | 16 |
| 2010 | 14 | 10 |
| 2011 | 8 | 29 |
| 2012 | 12 | 23 |
| 2013 | 22 | 39 |
| 2014 | 25 | 33 |
| 2015 | 29 | 48 |
| 2016 | 61 | 53 |
| 2017 | 46 | 34 |
| 2018 | 40 | 46 |
| 2019 | 61 | 56 |
| 2020 | 58 | 60 |
| 2021 | 48 | 50 |
| 2022 | 41 | 49 |
| 2023 | 32 | 54 |
| 2024 | 39 | 45 |
| 2025 | 38 | 48 |
| 2026 | 30 | 60 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical module6 Oct 2026US 12,754,383 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Connector assembly8 Sep 2026US 12,730,270 B2Molex Incorporated
- Bridge coupling to surface emitters8 Sep 2026US 12,733,090 B2Credo Technology Group Limited
- Pluggable optical module11 Aug 2026US 12,706,418 B2Lumentum Operations LLC
- Receptacle module for a communication system28 Jul 2026US 12,695,220 B2TE Connectivity Solutions GmbH
- Fiber optic cable structure including foldable fiber optic cable with coupler therefor and related method1 Oct 2026US 2026/0299226 A1GLOBALFOUNDRIES U. S. Inc.
- Processor package integrated with optical engine, electronic device including the processor package, and method of manufacturing the processor package1 Oct 2026US 2026/0299227 A1Samsung Electronics Co., Ltd.
- Next generation fiber optic module1 Oct 2026US 2026/0299228 A1
- Optical module with photonic chip and carrier1 Oct 2026US 2026/0299230 A1Global Technology Inc.
- Co-packaged optics structure with optical connectors having waveguide stress relief features24 Sep 2026US 2026/0287830 A1International Business Machines Corporation
Most cited
By later US patents
- Removable transceiver module and receptacle254US 5,879,173 AMethode Electronics, Inc. · 1999
- Optical receptacle, transceiver and cage199US 6,854,894 B12005
- Fiber optic connector183US 4,699,455 AAllen-Bradley Company, Inc. · 1987
- Pluggable electronic module and receptacle with heat sink183US 6,816,376 B2Tyco Electronics Corporation · 2004
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999