Optical module with photonic chip and carrier

Abstract

The present disclosure provides an optical module including a substrate, a carrier, a photonic chip, and an optical transmission assembly. The substrate includes a first body having a mounting surface and a recessed space recessed from the mounting surface. The carrier includes a second body and two first flanges. The second body has a carrier surface, and the two first flanges are disposed on opposite sides of the second body, respectively. The two first flanges are coupled to the mounting surface. At least a part of the carrier surface is disposed within the recessed space. The photonic chip includes a waveguide layer and a cladding layer stacked with each other. The cladding layer faces and coupled to the mounting surface. The photonic chip and the carrier are spatially separated. The optical transmission assembly is coupled to the carrier surface and optically coupled to the waveguide layer.

Dependencies are inferred from the claim text.