Transistor-outline package and preparation method thereof, optical sub-assembly, optical module, and optical network system

An optical module, comprising a housing and an optical sub-assembly comprising a transistor body and at least one transistor-outline package, which comprises:

• a transistor base;
• a transistor cap disposed on a first side surface of the transistor base, wherein the transistor cap and the transistor base form an accommodation cavity;
• a first lens disposed on a top of the transistor cap and penetrating the transistor cap, wherein the first lens is configured to collimate a first light ray transmitted by an optical fiber and emit the first light ray into the accommodation cavity;
• a light filtering assembly disposed on a side of the accommodation cavity that is behind the first lens, wherein the light filtering assembly is configured to receive the first light ray and split the first light ray into a second light ray and a third light ray;
• a lens assembly disposed in the accommodation cavity and located on a side of the light filtering assembly that is behind the light filtering assembly, wherein the lens assembly comprises a second lens and a third lens, wherein the second lens receives the second light ray and converges the second light ray, and wherein the third lens receives the third light ray and converges the third light ray;
• a first optical receiving chip disposed in the accommodation cavity and located on the first side surface of the transistor base, and wherein the first optical receiving chip is configured to receive the second light ray;
• and
• a second optical receiving chip disposed in the accommodation cavity and located on the first side surface of the transistor base, and wherein the second optical receiving chip is configured to receive the third light ray,
• wherein the transistor body comprises an inner cavity, wherein the inner cavity is configured to transmit a light ray, wherein the transistor-outline package is mounted on a transistor wall of the transistor body, and wherein the first lens faces the inner cavity and receives the first light ray, and
• wherein the optical sub-assembly is mounted on the housing, wherein the housing comprises an optical fiber interface, wherein the optical fiber interface is opposite to an adapter mounted on the transistor body, and wherein the optical fiber is connected to the adapter through the optical fiber interface.

A system, the system comprising an optical line terminal and an optical network unit, wherein the optical line terminal is connected to the optical network unit by using a passive optical distribution network, the optical line terminal comprising an optical sub-assembly or the optical network unit comprising the optical sub-assembly, the optical sub-assembly comprising a transistor body and at least one transistor-outline package, the system further comprising:

• a transistor base;
• a transistor cap disposed on a first side surface of the transistor base, wherein the transistor cap and the transistor base form an accommodation cavity;
• a first lens disposed on a top of the transistor cap and penetrating the transistor cap, and wherein the first lens is configured to collimate a first light ray transmitted by an optical fiber and emit the first light ray into the accommodation cavity;
• a light filtering assembly disposed on a side of the accommodation cavity that is behind the first lens, wherein the light filtering assembly is configured to receive the first light ray and split the first light ray into a second light ray and a third light ray;
• a lens assembly disposed in the accommodation cavity and located on a side of the light filtering assembly that is behind the light filtering assembly, wherein the lens assembly comprises a second lens and a third lens, wherein the second lens receives the second light ray and converges the second light ray, and wherein the third lens receives the third light ray and converges the third light ray;
• a first optical receiving chip, the lens assembly disposed in the accommodation cavity, and located on the first side surface of the transistor base, and wherein the first optical receiving chip is configured to receive the second light ray;
• and
• a second optical receiving chip disposed in the accommodation cavity and located on the first side surface of the transistor base, and wherein the second optical receiving chip is configured to receive the third light ray,
• wherein the transistor body comprises an inner cavity, wherein the inner cavity is configured to transmit a light ray, wherein the transistor-outline package is mounted on a transistor wall of the transistor body, and wherein the first lens faces the inner cavity and receives the first light ray.