Optical connection module

Abstract

An optical connection module, including a circuit substrate, an optical fiber array, a transimpedance amplifier, and a photoelectric conversion element. The optical fiber array is disposed on the circuit substrate and includes a transmission end. The transimpedance amplifier is disposed on the circuit substrate and is electrically connected to the circuit substrate. The transimpedance amplifier is flip-chip packaged onto the circuit substrate. The photoelectric conversion element contacts the transimpedance amplifier and is coupled to the transmission end. The photoelectric conversion element is disposed between the transimpedance amplifier and the transmission end to convert an optical signal into an electrical signal and then transmit the electrical signal to the transimpedance amplifier.

Dependencies are inferred from the claim text.