G02B 6/4255
Moulded or casted packages
Official title: {Moulded or casted packages}
G02B6/4255 (Moulded or casted packages) appears on 238 US grants and 231 published applications in this corpus.
Search patents in G02B- Granted patents
- 238
- Published applications
- 231
- Assignees
- 136
- Inventors
- 558
- Latest grant
- 30 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 5 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 4 | 0 |
| 2001 | 8 | 3 |
| 2002 | 12 | 12 |
| 2003 | 13 | 24 |
| 2004 | 17 | 8 |
| 2005 | 8 | 15 |
| 2006 | 9 | 8 |
| 2007 | 8 | 4 |
| 2008 | 9 | 9 |
| 2009 | 3 | 7 |
| 2010 | 6 | 3 |
| 2011 | 5 | 7 |
| 2012 | 3 | 1 |
| 2013 | 2 | 2 |
| 2014 | 4 | 9 |
| 2015 | 7 | 7 |
| 2016 | 12 | 12 |
| 2017 | 12 | 16 |
| 2018 | 15 | 14 |
| 2019 | 11 | 6 |
| 2020 | 8 | 6 |
| 2021 | 6 | 7 |
| 2022 | 4 | 7 |
| 2023 | 3 | 7 |
| 2024 | 3 | 9 |
| 2025 | 8 | 19 |
| 2026 | 5 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Optical packaging using embedded-in-mold (EIM) optical module integration30 Jun 2026US 12,669,659 B2Intel Corporation
- Packaging optical components in a circuit package9 Jun 2026US 12,650,563 B2Celestial Al Inc.
- Converting processing dimensions of a wafer package10 Mar 2026US 12,571,971 B2Celestial AI Inc.
- Preserving access to edge coupling components on a wafer package3 Mar 2026US 12,566,305 B2Celestial AI Inc.
- Die first fan-out architecture for electric and optical integration24 Feb 2026US 12,560,771 B2Intel Corporation
- Fixture and associated methods for hermetic feedtrhough assembly17 Sep 2026US 2026/0276899 A1Corning Research & Development Corporation
- Semiconductor Device and Method of Making Using Ultraviolet Light for Photonics Protection17 Sep 2026US 2026/0283012 A1STATS ChipPAC Pte. Ltd.
- Sensor and tof camera using same20 Aug 2026US 2026/0243899 A1Lipac Co., Ltd.
- Semiconductor package19 Mar 2026US 2026/0083008 A1Samsung Electronics Co., Ltd.
- Fan-out package including a photonic integrated circuit5 Mar 2026US 2026/0063859 A1Nokia Solutions and Networks Oy
Most cited
By later US patents
- Optical receptacle, transceiver and cage199US 6,854,894 B12005
- Adapter for pluggable module114US 7,934,959 B2Mellanox Technologies, Ltd. · 2011
- Enhanced folded flexible cable packaging for use in optical transceivers73US 6,685,364 B1International Business Machines Corporation · 2004
- Encapsulation of optoelectronic components58US 5,818,990 ATelefonaktiebolaget LM Ericsson · 1998
- Optical device56US 6,530,698 B1Sumitomo Electric Industries, Ltd. · 2003