Optical packaging using embedded-in-mold (EIM) optical module integration
AssigneeIntel Corporation
InventorsDowon Kim, Suohai Mei, Pooya Tadayon, Jason Michael Gamba, Sanka Ganesan
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Abstract
In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface to optically couple a fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a mold.
Claims18
An optical module, comprising:
- an electronic integrated circuit (EIC);
- a photonic integrated circuit (PIC) to send or receive optical signals;
- a pluggable optical coupling connector (POCC) adjacent to the PIC, wherein the POCC comprises a pluggable interface to optically couple a fiber array to the PIC;
- and
- a hybrid interposer, wherein the hybrid interposer comprises:
- one or more electrical interconnections between the EIC and the PIC;
- and
- one or more optical interconnections between the PIC and the POCC;
- wherein the EIC, the PIC, the POCC, and the hybrid interposer are embedded in a mold.
A computing device, comprising:
- processing circuitry;
- memory circuitry;
- and
- communication circuitry, wherein the communication circuitry comprises an optical transceiver to send and receive optical transmissions, wherein the optical transceiver comprises:
- an electronic integrated circuit (EIC);
- a photonic integrated circuit (PIC);
- a pluggable optical coupling connector (POCC) adjacent to the PIC, wherein the POCC comprises a pluggable interface to optically couple a fiber array to the PIC;
- and
- a hybrid interposer, wherein the hybrid interposer comprises:
- one or more electrical interconnections between the EIC and the PIC;
- and
- one or more optical interconnections between the PIC and the POCC;
- wherein the EIC, the PIC, the POCC, and the hybrid interposer are embedded in a mold.
A method of packaging an optical module, comprising:
- forming interconnect structures on a wafer;
- bonding a hybrid interposer on the wafer, wherein the hybrid interposer is aligned with the interconnect structures, and wherein the hybrid interposer comprises:
- one or more electrical interconnections between the EIC and the PIC;
- and
- one or more optical interconnections between the PIC and the POCC;
- bonding an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) face down on the hybrid interposer;
- bonding a pluggable optical coupling connector (POCC) on a backside of the PIC, wherein the POCC comprises:
- a pluggable interface to optically couple a fiber array to the PIC;
- and
- a temporary cover lid to protect the pluggable interface from contamination;
- embedding the EIC, the PIC, the POCC, and the hybrid interposer in a mold;
- grinding a top surface of the mold to remove the temporary cover lid of the POCC;
- releasing the wafer;
- forming a ball array below the optical module;
- and
- singulating the optical module.
Dependencies are inferred from the claim text.