Semiconductor package

A semiconductor package comprising:

• a substrate having a recess;
• a waveguide structure in the recess, the waveguide structure comprising a waveguide array;
• an optical integrated circuit above the waveguide structure, the optical integrated circuit optically connected to the waveguide structure;
• an electronic integrated circuit on the optical integrated circuit;
• a semiconductor chip on the electronic integrated circuit;
• a first conductive post connecting the substrate and the electronic integrated circuit;
• and
• a second conductive post connecting the substrate and the semiconductor chip,
• wherein a first side surface of the electronic integrated circuit is not aligned with a first side surface of the optical integrated circuit, and
• a first side surface of the semiconductor chip is not aligned with a second side surface of the electronic integrated circuit.

A semiconductor package comprising:

• a substrate having a recess;
• a waveguide structure in the recess, the waveguide structure comprising a waveguide array;
• an optical integrated circuit above the waveguide structure, the optical integrated circuit optically connected to the waveguide structure;
• an electronic integrated circuit on the optical integrated circuit, wherein a center of the electronic integrated circuit is misaligned with a center of the optical integrated circuit;
• a semiconductor chip on the electronic integrated circuit, wherein a center of the semiconductor chip being is misaligned with the center of the electronic integrated circuit;
• a redistribution structure above the substrate;
• a first conductive post electrically connecting the redistribution structure and the electronic integrated circuit;
• and
• a second conductive post electrically connecting the redistribution structure and the semiconductor chip,
• wherein a distance between an upper surface of the waveguide structure and a lower surface of the substrate is equal to a distance between an upper surface of the redistribution structure and the lower surface of the substrate, and
• wherein a side surface of the waveguide structure is aligned with a side surface of the substrate.