Back to results
US 12,560,771 B2Granted
Die first fan-out architecture for electric and optical integration
AssigneeIntel Corporation
InventorsBai Nie, Pooya Tadayon, Leonel R. Arana, Yonggang Li, Changhua Liu, Kristof Darmawikarta, Srinivas Venkata Ramanuja Pietambaram, Tarek A. Ibrahim, Hari Mahalingam, Benjamin Duong
Life of this patent
Estimating the term…
Abstract
An electronic device and associated methods are disclosed. In one example, the electronic device includes a photonic integrated circuit and an in situ formed waveguide. In selected examples, the electronic device includes a photonic integrated circuit coupled to an electronic integrated circuit, in a glass layer, where a waveguide is formed in the glass layer.
Claims14
A semiconductor assembly comprising:
- a glass layer;
- a first integrated circuit die;
- a second integrated circuit die at least partially in the glass layer, wherein the second integrated circuit die is configured to produce an optical signal at a die output port;
- a waveguide in the glass layer and optically coupled with the die output port, the waveguide comprising glass of a refractive index different from that of a bulk of the glass layer surrounding the waveguide, and the waveguide curving from a first end of the waveguide intersecting an edge of the glass layer adjacent to the die output port to a second end of the waveguide intersecting a first surface of the glass layer non-parallel to the edge of the glass layer;
- and
- one or more redistribution layers on the first surface of the glass layer and electrically connecting the first integrated circuit die and the second integrated circuit die, wherein the redistribution layers comprise an opening extending through a thickness of the redistribution layers, the second end of the waveguide exposed at a bottom of the opening to couple with an optical fiber aligned with the opening.
3 more elements
An apparatus, comprising:
- a first integrated circuit (IC) die;
- a second IC die, wherein a first surface of the first IC die is co-planar with a first surface of the second IC die;
- a glass layer, wherein a first surface of the glass layer is co-planar with features on the first surface of the first IC die and with features on the first surface of the second IC die, and wherein a cavity edge of the glass layer is adjacent to the first IC die;
- an optical waveguide within the glass layer and coupled with an optical output port of the first IC die, wherein the optical waveguide has a refractive index different from that of a portion of the glass layer surrounding the optical waveguide and wherein the optical waveguide curves from a first end intersecting the cavity edge of the glass layer to a second end of the optical waveguide that intersects the first surface of the glass layer;
- and
- one or more redistribution layers on the first surface of the glass layer and electrically connecting the features on the first surface of the first IC die to the features on the first surface of the second IC die, wherein the redistribution layers comprise an opening extending through a thickness of the redistribution layers, the second end of the optical waveguide exposed at a bottom of the opening to couple with an optical fiber aligned with the opening.
3 more elements
Dependencies are inferred from the claim text.