Fan-out package including a photonic integrated circuit

Abstract

A method is provided for fabricating a chip package comprising one or more chips including a photonic integrated circuit (PIC) comprising one or more optical modulators. The method includes forming a redistribution layer (RDL). The method also includes forming a dam on a bonding side of the RDL. The method also includes arranging the one or more chips on the bonding side of the RDL and bonding the one or more chips to the RDL. The dam surrounds an empty space between the RDL and the one or more optical modulators. The method also includes dispensing underfill material between at least some of the one or more chips and the RDL. The dam prevents the underfill material from entering the empty space between the RDL and the one or more optical modulators.

Dependencies are inferred from the claim text.