Sensor and tof camera using same

Abstract

Provided are a time of flight (ToF) sensor and a ToF camera using same, the sensor enabling a light emitting unit and a light receiving unit to be packaged into one or two system-in-packages (SIP) at a wafer level by using semiconductor packaging according to fan-out wafer level package (FOWLP), thereby implementing an ultra-thin package. The ToF camera includes: a light emitting unit emitting light to an object; a light receiving unit for receiving reflected light reflected from the object and sensing same; a lens unit for controlling the path of the light so that the light is emitted at the object and the reflected light reflected from the object is received by the light receiving unit; and a control unit having a controller printed circuit board (PCB), which has the light emitting unit and the light receiving unit mounted on the bottom surface thereof and has the lens unit mounted on the top surface thereof.

Dependencies are inferred from the claim text.