G02B 6/4274
Electrical aspects
Official title: {Electrical aspects (G02B6/4263 and G02B6/4265 take precedence)}
G02B6/4274 (Electrical aspects) appears on 3,569 US grants and 4,197 published applications in this corpus.
Search patents in G02B- Granted patents
- 3,569
- Published applications
- 4,197
- Assignees
- 943
- Inventors
- 6,210
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 10 | 0 |
| 1991 | 7 | 0 |
| 1992 | 13 | 0 |
| 1993 | 15 | 0 |
| 1994 | 18 | 0 |
| 1995 | 6 | 0 |
| 1996 | 11 | 0 |
| 1997 | 15 | 0 |
| 1998 | 28 | 0 |
| 1999 | 29 | 0 |
| 2000 | 26 | 0 |
| 2001 | 44 | 22 |
| 2002 | 72 | 109 |
| 2003 | 83 | 122 |
| 2004 | 96 | 90 |
| 2005 | 89 | 107 |
| 2006 | 89 | 78 |
| 2007 | 69 | 85 |
| 2008 | 69 | 55 |
| 2009 | 64 | 44 |
| 2010 | 45 | 59 |
| 2011 | 41 | 90 |
| 2012 | 43 | 101 |
| 2013 | 70 | 150 |
| 2014 | 99 | 189 |
| 2015 | 179 | 190 |
| 2016 | 226 | 256 |
| 2017 | 250 | 248 |
| 2018 | 230 | 241 |
| 2019 | 248 | 218 |
| 2020 | 229 | 242 |
| 2021 | 185 | 212 |
| 2022 | 157 | 233 |
| 2023 | 173 | 250 |
| 2024 | 166 | 264 |
| 2025 | 205 | 312 |
| 2026 | 143 | 230 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- G02B 6/428Containing printed circuit boards [pcb]1,765
- G02B 6/4284Of optical modules with disconnectable electrical connectors929
- G02B 6/4277Protection against electromagnetic interference [emi]751
- G02B 6/4278Related to pluggable or demountable opto-electronic or electronic elements287
- G02B 6/4279Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations268
- G02B 6/4283With electrical insulation means214
- G02B 6/4275Protection against electrostatic discharge [esd]22
Recent patents
- Electro-optical circuits with modular switchable photonic interface6 Oct 2026US 12,754,376 B2Intel Corporation
- Optical module6 Oct 2026US 12,754,383 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Optical fiber array with optical passthrough6 Oct 2026US 12,754,384 B2Lightmatter, Inc.
- Connector assembly with improved heat dissipation effect6 Oct 2026US 12,756,145 B2Dongguan Luxshare Technologies Co., Ltd
- Optical devices29 Sep 2026US 12,748,256 B2Taiwan Semiconductor Manufacturing Company.Ltd
- 3D System and Wafer Reconstitution with Mid-layer Interposer8 Oct 2026US 2026/0309944 A1Apple Inc.
- Photonic package8 Oct 2026US 2026/0309945 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Dual duplex belly-to-belly little connector (bblc) based optical connectors8 Oct 2026US 2026/0309946 A1II-Vi Delaware, Inc.
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Optoelectronic component with encapsulant486US 7,208,725 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component comprising an encapsulant486US 7,781,727 B2Nuvotronics, LLC · 2010
- Wafer-level optoelectronic device substrate484US 7,288,758 B2Rohm and Haas Electronic Materials LLC · 2007
- Optoelectronic component with flip-chip mounted optoelectronic device484US 8,049,161 B2Samsung Electronics Co., Ltd. · 2011
- Optical ready substrates300US 7,110,629 B2APPLIED Materials.Inc. · 2006