3D System and Wafer Reconstitution with Mid-layer Interposer
AssigneeApple Inc.
InventorsSanjay Dabral, SivaChandra Jangam
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Abstract
A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while the first package level components can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds. Dies within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.
Claims17
An optoelectronic assembly comprising:
- an interposer comprising:
- a glass bulk layer;
- a back-end-of-the-line (BEOL) build-up structure on the glass bulk layer, the BEOL build-up structure including one or more dielectric layers and metal wiring layers;
- a waveguide;
- and
- a plurality of through glass vias extending through the glass bulk layer and in electrical connection with the one or more wiring layers;
- and
- a plurality of second level components mounted on a top side of the interposer, the plurality of second level components including a first-second level component that includes an electrical-to-optical (EO) converter to transmit an optical signal through an optical path extending between the EO converter and the waveguide.
Dependencies are inferred from the claim text.