Photonic package

A semiconductor package, comprising:

• a substrate;
• a micro lens recessed from a top surface of the substrate, wherein a concave area is formed between a surface of the micro lens and the top surface of the substrate;
• a first dielectric material filling a portion the concave area and being close to the surface of the micro lens;
• a second dielectric material filling a remainder of the concave area and being over the first dielectric material, wherein an interface is formed between the first dielectric material and the second dielectric material, and the interface is lower than the top surface of the substrate;
• a bonding layer formed over the top surface of the substrate and contacting the second dielectric material;
• and
• a semiconductor wafer bonded to the bonding layer, wherein the semiconductor wafer includes an optical component therein and aligned with the micro lens.

A semiconductor package, comprising:

• a substrate;
• a micro lens recessed from a top surface of the substrate, wherein a concave area is formed between a surface of the micro lens and the top surface of the substrate;
• a first dielectric material filling a portion of the concave area and being close to the surface of the micro lens, wherein the first dielectric material extends over the top surface of the substrate;
• a second dielectric material filling a remainder of the concave area and being over the first dielectric material, wherein a top surface of the second dielectric material is flush with a top surface of the first dielectric layer;
• a bonding layer formed over the top surface of the substrate, the first dielectric material, and the second dielectric material;
• and
• a semiconductor wafer bonded to the bonding layer, wherein the semiconductor wafer includes an optical component therein and aligned with the micro lens.