G02B 6/428
Containing printed circuit boards [pcb]
Official title: {containing printed circuit boards [PCB]}
G02B6/428 (Containing printed circuit boards [pcb]) appears on 1,765 US grants and 2,191 published applications in this corpus.
Search patents in G02B- Granted patents
- 1,765
- Published applications
- 2,191
- Assignees
- 552
- Inventors
- 3,534
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 7 | 0 |
| 1998 | 10 | 0 |
| 1999 | 6 | 0 |
| 2000 | 5 | 0 |
| 2001 | 15 | 4 |
| 2002 | 12 | 31 |
| 2003 | 23 | 39 |
| 2004 | 27 | 27 |
| 2005 | 32 | 42 |
| 2006 | 35 | 35 |
| 2007 | 30 | 35 |
| 2008 | 25 | 18 |
| 2009 | 22 | 15 |
| 2010 | 20 | 20 |
| 2011 | 15 | 44 |
| 2012 | 20 | 47 |
| 2013 | 32 | 73 |
| 2014 | 43 | 97 |
| 2015 | 102 | 102 |
| 2016 | 122 | 164 |
| 2017 | 164 | 163 |
| 2018 | 139 | 155 |
| 2019 | 153 | 129 |
| 2020 | 128 | 136 |
| 2021 | 97 | 113 |
| 2022 | 88 | 124 |
| 2023 | 89 | 142 |
| 2024 | 103 | 142 |
| 2025 | 113 | 160 |
| 2026 | 70 | 134 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical module6 Oct 2026US 12,754,383 B2Hisense Broadband Multimedia Technologies Co., Ltd.
- Optical fiber array with optical passthrough6 Oct 2026US 12,754,384 B2Lightmatter, Inc.
- Optical module and optical communication device29 Sep 2026US 12,748,267 B2KYOCERA Corporation
- 400G silicon photonic integrated optical module with photoelectric integrated substrate29 Sep 2026US 12,748,268 B2SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- High density fiber optic packaging for cryogenic applications22 Sep 2026US 12,743,649 B2Massachusetts Institute of Technology
- 3D System and Wafer Reconstitution with Mid-layer Interposer8 Oct 2026US 2026/0309944 A1Apple Inc.
- Semiconductor devices with photonic interconnect platforms and crossbar switches8 Oct 2026US 2026/0309948 A1
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
- Processor package integrated with optical engine, electronic device including the processor package, and method of manufacturing the processor package1 Oct 2026US 2026/0299227 A1Samsung Electronics Co., Ltd.
- Optical module with photonic chip and carrier1 Oct 2026US 2026/0299230 A1Global Technology Inc.
Most cited
By later US patents
- Removable transceiver module and receptacle254US 5,879,173 AMethode Electronics, Inc. · 1999
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999
- Small-scale optoelectronic package132US 6,910,812 B2Peregrine Semiconductor Corporation · 2005
- Pluggable optical transceiver module having a high speed serial data connector (HSSDC)114US 6,350,063 B1Stratos Lightwave, Inc. · 2002
- Adapter for pluggable module114US 7,934,959 B2Mellanox Technologies, Ltd. · 2011