Small-scale optoelectronic package

An optical/optoelectronic coupling system comprising:

• an optical fiber disposed in an optical fiber connector, wherein:
• the optical fiber connector has a first alignment means comprising a pair of guide holes;
• and
• the optical fiber is held in a precise positional relationship to the first alignment means;
• an optoelectronic device mounted on a transparent insulating substrate by flip-chip bonds of less than about 25 μm in height, wherein;
• the transparent insulating substrate has substantially parallel top and bottom surfaces and is positioned between the optical fiber and the optoelectronic device such that an optical path is provided between the optoelectronic device and the optical fiber through the transparent insulating substrate, passing through the top and bottom surfaces;
• said optical path is free of any optical lens;
• the transparent insulating substrate has a second alignment means comprising a pair of guide holes corresponding to the first alignment means;
• the optoelectronic device is mounted on the transparent insulating substrate in a precise positional relationship to the second alignment means;
• and
• alignment members comprising a pair of guide pins complementary to the first and second alignment means, whereby the optical fiber and optoelectronic device are aligned when the alignment members are coupled with the first and second alignment means.

An optoelectronic assembly, comprising:

• a transparent substrate having first and second surfaces and at least one electrical feature;
• at least one optoelectronic device attached to the first surface of said transparent substrate by flip-chip bonds of less than about 25 μm in height and in electrical contact with the at least one electrical feature;
• at least two alignment elements on the substrate;
• and
• an optical fiber member including an optical fiber in an optical fiber connector on the second surface of said substrate, wherein the optical fiber connector includes alignment means cooperative with said alignment elements on the substrate,
• wherein an optical path is formed between the optoelectronic device and the optical fiber through the transparent substrate, and wherein said optical path is free of any optical lens.