G02B 6/4279
Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
Official title: {Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations}
G02B6/4279 (Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations) appears on 268 US grants and 312 published applications in this corpus.
Search patents in G02B- Granted patents
- 268
- Published applications
- 312
- Assignees
- 145
- Inventors
- 650
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 3 | 4 |
| 2003 | 2 | 12 |
| 2004 | 11 | 9 |
| 2005 | 2 | 13 |
| 2006 | 12 | 7 |
| 2007 | 9 | 14 |
| 2008 | 8 | 4 |
| 2009 | 9 | 2 |
| 2010 | 3 | 5 |
| 2011 | 3 | 6 |
| 2012 | 2 | 6 |
| 2013 | 6 | 16 |
| 2014 | 8 | 14 |
| 2015 | 12 | 15 |
| 2016 | 18 | 20 |
| 2017 | 20 | 19 |
| 2018 | 18 | 32 |
| 2019 | 25 | 11 |
| 2020 | 20 | 23 |
| 2021 | 15 | 23 |
| 2022 | 17 | 13 |
| 2023 | 12 | 13 |
| 2024 | 7 | 14 |
| 2025 | 14 | 8 |
| 2026 | 8 | 9 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- High frequency emmitter and detector packaging scheme for 10GB/S transceiver224US 7,008,120 B2Intel Corporation · 2006
- Terahertz interconnect system and applications220US 6,967,347 B2The Regents of the University of Colorado · 2005
- Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes105US 6,818,464 B2Hymite A/S · 2004
- Transceiver and interface for IC package105US 8,588,561 B2Samtec, Inc. · 2013
- Transceiver and interface for IC package89US 8,787,711 B2Samtec, Inc. · 2014