3D system and wafer reconstitution with mid-layer interposer
AssigneeApple Inc.
InventorsSanjay Dabral, SivaChandra Jangam
Life of this patent
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Abstract
A system in package structure and method of fabrication using wafer reconstitution are described. In an embodiment a 3D system includes a mid-layer interposer a first package level underneath the mid-layer interposer and a second package level over the mid-layer interposer. Second package level components can be bonded to the mid-layer interposer with metal-metal bonds and optionally dielectric-dielectric bonds, while the first package level components can be bonded to the mid-layer interposer with dielectric-dielectric and optionally metal-metal bonds. Dies within the first and/or second package levels may optionally be connected with one or more optical interconnect paths.
Claims17
A three dimensional (3D) system comprising:
- a mid-layer interposer;
- a first package level underneath the mid-layer interposer, the first package level including a first first-level die directed bonded with the mid-layer interposer;
- and
- a second package level over the mid-layer interposer, the second package level including a first second-level die direct bonded with the mid-layer interposer and a second second-level die direct bonded with the mid-layer interposer;
- wherein the mid-layer interposer includes an electrical-to-optical (EO) converter electrically connected with the first second-level die, an optical-to-electrical (OE) converter electrically connected with the second second-level die, and an optical interconnect that connects the EO converter and the OE converter.
A three dimensional (3D) system comprising:
- a mid-layer interposer;
- a first package level underneath the mid-layer interposer, the first package level including a first first-level die directed bonded with the mid-layer interposer;
- and
- a second package level over the mid-layer interposer, the second package level including a first second-level die direct bonded with the mid-layer interposer and a second second-level die direct bonded with the mid-layer interposer;
- wherein the first second-level die includes an electrical-to-optical (EO) converter, and the second second-level die includes an optical-to-electrical (OE) converter;
- and
- wherein the mid-layer interposer includes an optical interconnect that is optically connected with the EO converter and the OE converter.
A 3D system comprising:
- a mid-layer interposer;
- a first package level including a first-level die directed bonded with the mid-layer interposer;
- a second package level including a second-level die directed bonded with the mid-layer interposer;
- wherein the first-level die or intermediate interposer includes an optical-to-electrical (OE) converter, and the second-level die includes an electrical-to-optical (EO) converters;
- and
- an optical via that optically connects the EO converter with the OE converter.
Dependencies are inferred from the claim text.