G02B 6/4266
Thermal aspects, temperature control or temperature monitoring
Official title: {Thermal aspects, temperature control or temperature monitoring (thermal aspect of electrical circuits H05K7/20, H05K5/0213, temperature control in general G05D23/19)}
G02B6/4266 (Thermal aspects, temperature control or temperature monitoring) appears on 1,669 US grants and 1,959 published applications in this corpus.
Search patents in G02B- Granted patents
- 1,669
- Published applications
- 1,959
- Assignees
- 569
- Inventors
- 3,705
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 3 | 0 |
| 1990 | 1 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 9 | 0 |
| 1994 | 6 | 0 |
| 1995 | 3 | 0 |
| 1996 | 2 | 0 |
| 1997 | 8 | 0 |
| 1998 | 20 | 0 |
| 1999 | 22 | 0 |
| 2000 | 17 | 0 |
| 2001 | 26 | 12 |
| 2002 | 27 | 52 |
| 2003 | 36 | 72 |
| 2004 | 43 | 48 |
| 2005 | 43 | 60 |
| 2006 | 48 | 35 |
| 2007 | 37 | 28 |
| 2008 | 30 | 13 |
| 2009 | 17 | 16 |
| 2010 | 15 | 21 |
| 2011 | 16 | 23 |
| 2012 | 17 | 41 |
| 2013 | 32 | 44 |
| 2014 | 41 | 78 |
| 2015 | 57 | 80 |
| 2016 | 91 | 90 |
| 2017 | 99 | 102 |
| 2018 | 96 | 99 |
| 2019 | 114 | 118 |
| 2020 | 134 | 128 |
| 2021 | 96 | 114 |
| 2022 | 97 | 142 |
| 2023 | 91 | 128 |
| 2024 | 96 | 134 |
| 2025 | 96 | 144 |
| 2026 | 74 | 137 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Optical fiber array with optical passthrough6 Oct 2026US 12,754,384 B2Lightmatter, Inc.
- Fiber connector bulkhead adapter with shroud for protecting high-power fiber6 Oct 2026US 12,754,385 B2nLIGHT, Inc.
- Optical module29 Sep 2026US 12,748,272 B2Sumitomo Electric Industries, Ltd.
- Enhanced optical module cooling with angled fins29 Sep 2026US 12,748,273 B2Ciena Corporation
- 400G silicon photonic package with self-aligned fiber22 Sep 2026US 12,742,940 B2SHUNYUN TECHNOLOGY (ZHONGSHAN) Limited
- Heterogeneous packaging integration of photonic and electronic elements8 Oct 2026US 2026/0309942 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Adaptive thermal control for micro-ring modulators in photonic links8 Oct 2026US 2026/0309943 A1Samsung Electronics Co., Ltd.
- Dual duplex belly-to-belly little connector (bblc) based optical connectors8 Oct 2026US 2026/0309946 A1II-Vi Delaware, Inc.
- Waveguide structure and method for forming the same8 Oct 2026US 2026/0310012 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor Device and Method of Forming Fan-Out Wafer Level CPO with Through Silicon Conductive Via1 Oct 2026US 2026/0299219 A1STATS ChipPAC Pte. Ltd.
Most cited
By later US patents
- Optical transmission terminal device160US 5,960,141 AFujitsu Limited · 1999
- Temperature stable solid-state laser package132US 5,181,214 AHarmonic Lightwaves, Inc. · 1993
- Small-scale optoelectronic package132US 6,910,812 B2Peregrine Semiconductor Corporation · 2005
- Channel-switched cross-connect114US 6,243,517 B1Sparkolor Corporation · 2001
- Multiwavelength actively mode-locked external cavity semiconductor laser111US 6,192,058 B1Sarnoff Corporation · 2001