Enhanced optical module cooling with angled fins
AssigneeCiena Corporation
InventorsBonnie Lynne Mack, Georges Turcotte, Victor Aldea, Francois Pellerin
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Abstract
An optical module, such as a Quad Small Form Factor (QSFP) or variant thereof, or another type of module, includes a housing; an optical subassembly positioned within the housing at an angle relative to the housing; circuitry connected to the optical subassembly; and heat fins located on and in contact with the housing, wherein the heat fibers are positioned near the optical subassembly. The angling of the optical subassembly supports improved thermal performance, i.e., larger heat fin area at locations due to the angle, and eliminates any bend radius issues on fibers exiting the optical subassembly.
Claims15
An optical module comprising:
- a housing of the optical module, the housing enclosing internal components of the optical module and being configured to be inserted as a unit into a host device;
- an optical subassembly positioned within the housing and within a nose portion of the housing at an acute angle relative to a plane of a printed circuit board disposed within the housing;
- the printed circuit board comprising circuitry connected to the optical subassembly;
- and
- heat fins disposed on an exterior surface of the nose portion of the housing over the optical subassembly,
- wherein the heat fins have respective heights that increase with distance from a faceplate of the housing toward a middle portion of the housing such that tips of the heat fins define a generally common plane.
An optical module comprising:
- a housing including a faceplate, a nose portion adjacent to the faceplate, and a middle portion adjacent to the nose portion, wherein the optical module is configured in a Quad Small Form Factor (QSFP) family form factor, and wherein the housing is a housing of the optical module, encloses internal components of the optical module, and is configured to be inserted as a unit into a host device;
- an optical subassembly positioned within the housing and within the nose portion at an acute angle relative to a plane of a printed circuit board disposed within the housing;
- the printed circuit board comprising circuitry connected to the optical subassembly;
- and
- heat fins disposed on an exterior surface of the nose portion of the housing over the optical subassembly,
- wherein the heat fins have respective heights that increase with distance from the faceplate toward the middle portion such that tips of the heat fins define a generally common plane.
Dependencies are inferred from the claim text.