G02B 6/4273
With heat insulation means to thermally decouple or restrain the heat from
Official title: {with heat insulation means to thermally decouple or restrain the heat from spreading}
G02B6/4273 (With heat insulation means to thermally decouple or restrain the heat from) appears on 72 US grants and 75 published applications in this corpus.
Search patents in G02B- Granted patents
- 72
- Published applications
- 75
- Assignees
- 67
- Inventors
- 237
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 2 |
| 2002 | 3 | 3 |
| 2003 | 4 | 5 |
| 2004 | 1 | 2 |
| 2005 | 4 | 0 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 7 |
| 2015 | 6 | 3 |
| 2016 | 5 | 6 |
| 2017 | 4 | 2 |
| 2018 | 1 | 3 |
| 2019 | 3 | 6 |
| 2020 | 8 | 10 |
| 2021 | 4 | 3 |
| 2022 | 6 | 4 |
| 2023 | 2 | 5 |
| 2024 | 3 | 3 |
| 2025 | 1 | 4 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Undercut architectures for improved thermal efficiency in photonic integrated circuit (PIC) architectures15 Sep 2026US 12,736,762 B2Altera Corporation
- Thermal structure for a micro-ring resonator (MRR) in a photonic integrated circuit (PIC)14 Jul 2026US 12,681,243 B2Intel Corporation
- Red green blue laser module16 Jun 2026US 12,658,676 B2KYOCERA SLD Laser, Inc.
- Techniques for thermal management within optical subassembly modules27 May 2025US 12,313,892 B2Applied Optoelectronics, Inc.
- Optical module27 Aug 2024US 12,075,559 B2Innolight Technology Pte. Ltd.
- Thermal isolation of laser tuning sections27 Aug 2026US 2026/0251870 A1Lumentum Operations LLC
- Housing for accommodating a photonic integrated circuit chip23 Jul 2026US 2026/0211198 A1Light Trace Photonics Ltd
- Optical devices and methods of manufacture18 Jun 2026US 2026/0169242 A1
- Semiconductor package and method of manufacturing the same1 Jan 2026US 2026/0003143 A1Samsung Electronics Co., Ltd.
- Optical Transceiver Module and Communication Device3 Jul 2025US 2025/0220861 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Optoelectronic assembly and method of making the same74US 5,977,567 ALightlogic, Inc. · 1999
- Thermally insulated distributed light network from a central light source57US 5,436,805 AHughes Aircraft Company · 1995
- Laser diode and substrate46US 6,146,025 ALitton Systems, Inc. · 2000
- Optical communication device44US 6,567,590 B1NHK Spring Co., Ltd. · 2003
- Optical fiber-optical device coupling package and optical fiber-optical device module40US 5,436,997 AFujitsu Limited · 1995