Laser diode and substrate

An improved laser diode comprising:

• a laser diode chip, having an optical port for outputing an optical signal and at least one laser diode heat sink surface,
• a substrate having a top and bottom surface, the laser diode heat sink surface being mounted on the top surface, the substrate top surface having a perimeter that extends beyond the area of the laser diode heat sink surface;
• an optical fiber having a lens face, the optical fiber being secured at a pad location on the substrate top surface with a solder ball, the receiving lens face being positioned close to the optical port to receive optical power from the optical port,
• a heat sink having a top surface, the heat sink top surface having a perimeter,
• a portion of the substrate bottom surface being mounted on the heat sink top surface, an overhang portion of the substrate extending beyond the heat sink top surface perimeter, the overhang portion of the substrate forming a ledge portion of the substrate,
• a thermal insulating slot being formed in the substrate overhang portion between the pad location and the heat sink top surface perimeter,
• a stress relief slot being formed in the overhang portion of the substrate, the stress relief slot extending from the edge of the substrate to an end of the thermal insulating slot.

An laser diode comprising:

• a substrate having a top and bottom surface and
• an "L" shaped slot, the "L" shaped slot having
• a stress relief slot and
• a thermal insulating slot, the stress relief slot beginning at an edge of the substrate and terminating at the beginning of the insulating slot, the "L" shaped slot defining a border around
• a canteleverd fiber support segment, a pad for receiving a solder preform is positioned on the surface of the fiber support segment,
• an optical component having an optical port, the optical component being mounted on the substrate,
• an optical fiber having a lens face, the optical fiber being aligned to optically couple the lens face to the optical port, the optical fiber being mounted on the substrate by being embedded in the solder from the solder preform.